IC插座

结果:
24,020
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
结果24,020
选择
图片产品详情单价可用性ECAD 模型Pitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostSeriesNumber of Positions or Pins (Grid)Operating TemperatureTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
808-AG11D-ESL-LF
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4,008 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
800
8 (2 x 4)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8444-21B1-RK-TP
CONN SOCKET PLCC 44POS TIN
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2,773 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
8400
44 (4 x 11)
-40°C ~ 105°C
PLCC
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
3-1571552-6
824-AG31D-ESL-LF=800 DIP GF/SN
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10 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
1051900001
TOP-MOUNT CAMERA SOCKET FOR SMIA
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数量
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PCB Symbol, Footprint & 3D Model
0.033" (0.85mm)
Gold
Surface Mount
Solder
0.033" (0.85mm)
Gold
105190
12 (2 x 6)
-55°C ~ 85°C
Camera Socket
12.0µin (0.30µm)
Phosphor Bronze Alloy
Open Frame
Flash
Phosphor Bronze Alloy
Thermoplastic
1051670001
SMIA65 TOP MNT CAMERA SOCKET
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数量
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PCB Symbol, Footprint & 3D Model
0.037" (0.95mm)
Gold
Surface Mount
Solder
-
Gold
105167
12 (2 x 6)
-55°C ~ 85°C
Camera Socket
12.0µin (0.30µm)
Copper Alloy
Open Frame
Flash
Copper Alloy
Thermoplastic
1051990001
CONN CAM SOCKET 34POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.024" (0.60mm)
Gold
Surface Mount
Solder
0.024" (0.60mm)
-
105199
34 (2 x 8, 2 x 9)
-30°C ~ 85°C
Camera Socket
12.0µin (0.30µm)
Copper Alloy
Closed Frame
-
Copper Alloy
Plastic
1051420132
CONN SOCKET LGA 2011POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.040" (1.02mm)
Gold
Surface Mount
Solder
0.040" (1.01mm)
-
105142
2011 (47 x 58)
-
LGA
15.0µin (0.38µm)
Copper Alloy
Open Frame
-
-
Thermoplastic
1-382568-6
CONN IC DIP SOCKET 16POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Diplomate DL
16 (2 x 8)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
Thermoplastic, Glass Filled
1-1571551-2
CONN IC DIP SOCKET 40POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
500
40 (2 x 20)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571551-5
CONN IC DIP SOCKET 18POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
500
18 (2 x 9)
-55°C ~ 125°C
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Closed Frame
Flash
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4-1571551-1
CONN IC DIP SOCKET 6POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
500
6 (2 x 3)
-55°C ~ 125°C
DIP, 0.3" (7.62mm) Row Spacing
25.0µin (0.63µm)
Beryllium Copper
Closed Frame
25.0µin (0.63µm)
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
6-1437539-3
CONN IC DIP SOCKET 22POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
800
22 (2 x 11)
-55°C ~ 105°C
DIP, 0.4" (10.16mm) Row Spacing
5.00µin (0.127µm)
Copper Alloy
Open Frame
-
-
Polyester
643648-8
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Diplomate DL
16 (1 x 16)
-55°C ~ 105°C
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
Thermoplastic, Glass Filled
8-1437532-2
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
-
Through Hole
Wire Wrap
0.100" (2.54mm)
-
500
40 (2 x 20)
-
DIP, 0.6" (15.24mm) Row Spacing
-
-
Closed Frame
-
-
-
3-1437530-3
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
500
16 (1 x 16)
-
SIP
-
Beryllium Copper
-
-
Beryllium Copper
Thermoplastic
4-1437530-7
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
500
3 (1 x 3)
-
SIP
-
Beryllium Copper
-
-
Beryllium Copper
Thermoplastic
2-641614-4
CONN IC DIP SOCKET 24POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Diplomate DL
24 (2 x 12)
-
DIP, 0.6" (15.24mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Open Frame
15.0µin (0.38µm)
Phosphor Bronze
-
6-1437536-1
CONN IC DIP SOCKET 28POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
-
500
28 (2 x 14)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Brass
-
1-345830-1
CONN IC DIP SOCKET 16POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole, Right Angle, Vertical
-
-
-
-
16 (2 x 8)
-
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
-
Closed Frame
-
-
-
1437508-6
CONN TRANSIST TO-5 8POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
Gold
Through Hole
Solder
-
Gold
8058
8 (Round)
-55°C ~ 125°C
Transistor, TO-5
-
Beryllium Copper
Closed Frame
-
Brass
Polytetrafluoroethylene (PTFE)

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。