IC插座

结果:
23,987
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
结果23,987
选择
图片产品详情单价可用性ECAD 模型SeriesMounting TypeContact Finish - MatingTerminationContact Finish - PostHousing MaterialOperating TemperatureTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish Thickness - MatingContact Material - MatingFeaturesPitch - PostContact Finish Thickness - PostContact Material - Post
1-2324271-2
LEFT SEGMEN LGA4189-4 SOCKET-P4
1+
¥234.0000
5+
¥221.0000
10+
¥208.0000
数量
720,000 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
Surface Mount
Gold
Solder
Gold
Thermoplastic
-25°C ~ 100°C
LGA 4189
2092
0.039" (1.00mm)
30.0µin (0.76µm)
Copper Alloy
Open Frame
0.034" (0.86mm)
30.0µin (0.76µm)
Copper Alloy
DILB18P-223TLF
CONN IC DIP SOCKET 18POS TINLEAD
1+
¥3.4596
5+
¥3.2674
10+
¥3.0752
数量
45,240 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
DILB
Through Hole
Tin-Lead
Solder
Tin-Lead
Polyamide (PA), Nylon
-55°C ~ 125°C
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
100.0µin (2.54µm)
Copper Alloy
Open Frame
0.100" (2.54mm)
100.0µin (2.54µm)
Copper Alloy
1-822473-4
1+
¥4.5000
5+
¥4.2500
10+
¥4.0000
数量
10,050 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
Through Hole
Tin
Solder
Tin
Thermoplastic
-
PLCC
44 (4 x 11)
0.050" (1.27mm)
-
Phosphor Bronze
Closed Frame
0.100" (2.54mm)
-
Phosphor Bronze
940-44-032-17-400004
CONN SOCKET PLCC 32POS SMD
1+
¥45.0000
5+
¥42.5000
10+
¥40.0000
数量
10,000 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
940
Surface Mount
Tin
Solder
Tin
Polyphenylene Sulfide (PPS)
-
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
150.0µin (3.81µm)
-
Closed Frame
0.050" (1.27mm)
200.0µin (5.08µm)
-
2-2129710-5
CONN SOCKET LGA 3647POS GOLD
1+
¥144.0000
5+
¥136.0000
10+
¥128.0000
数量
8,930 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
Surface Mount
Gold
Solder
-
Thermoplastic
-
LGA
3647
-
30.0µin (0.76µm)
Copper Alloy
Open Frame
-
-
Copper Alloy
2-2129710-6
CONN SOCKET LGA 3647POS GOLD
1+
¥162.0000
5+
¥153.0000
10+
¥144.0000
数量
7,853 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
Surface Mount
Gold
Solder
-
Thermoplastic
-
LGA
3647
-
30.0µin (0.76µm)
Copper Alloy
Open Frame
-
-
Copper Alloy
1-2199298-3
CONN IC DIP SOCKET 14POS TIN
1+
¥1.6740
5+
¥1.5810
10+
¥1.4880
数量
7,571 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Diplomate DL
Through Hole
Tin
Solder
Tin
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
0.100" (2.54mm)
-
Brass, Copper
808-AG11D-ESL-LF
1+
¥10.8000
5+
¥10.2000
10+
¥9.6000
数量
5,208 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
800
Through Hole
Gold
Solder
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Flash
Beryllium Copper
Open Frame
0.100" (2.54mm)
Flash
Copper
ED28DT
CONN IC DIP SOCKET 28POS TIN
1+
¥3.5820
5+
¥3.3830
10+
¥3.1840
数量
4,238 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
ED
Through Hole
Tin
Solder
Tin
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
0.100" (2.54mm)
60.0µin (1.52µm)
Phosphor Bronze
110-87-314-41-001101
CONN IC DIP SOCKET 14POS GOLD
1+
¥18.0000
5+
¥17.0000
10+
¥16.0000
数量
4,000 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
110
Through Hole
Gold
Solder
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Flash
Beryllium Copper
Open Frame
0.100" (2.54mm)
-
Brass
4828-6004-CP
CONN IC DIP SOCKET 28POS TIN
1+
¥15.4800
5+
¥14.6200
10+
¥13.7600
数量
3,740 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
4800
Through Hole
Tin
Solder
Tin
Polyester, Glass Filled
-25°C ~ 85°C
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
0.100" (2.54mm)
35.0µin (0.90µm)
Phosphor Bronze
114-87-316-41-134161
CONN IC DIP SOCKET 16POS GOLD
1+
¥11.7900
5+
¥11.1350
10+
¥10.4800
数量
2,450 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
114
Surface Mount
Gold
Solder
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Flash
Beryllium Copper
Open Frame
0.100" (2.54mm)
-
Brass
940-44-068-24-000000
CONN SOCKET PLCC 68POS TIN
1+
¥18.0000
5+
¥17.0000
10+
¥16.0000
数量
2,163 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
940
Through Hole
Tin
Solder
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
PLCC
68 (4 x 17)
0.100" (2.54mm)
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
0.100" (2.54mm)
200.0µin (5.08µm)
Brass Alloy
1-390261-2
CONN IC DIP SOCKET 8POS TIN
1+
¥2.7000
5+
¥2.5500
10+
¥2.4000
数量
1,759 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
Through Hole
Tin
Solder
Tin
-
-40°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
0.100" (2.54mm)
60.0µin (1.52µm)
Phosphor Bronze
1-2324271-3
RIGHT SEGMEN LGA4189-4 SOCKET-P4
1+
¥171.0000
5+
¥161.5000
10+
¥152.0000
数量
1,563 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
Surface Mount
Gold
Solder
Gold
Thermoplastic
-25°C ~ 100°C
LGA 4189
2092
0.039" (1.00mm)
15.0µin (0.38µm)
Copper Alloy
Open Frame
0.034" (0.86mm)
15.0µin (0.38µm)
Copper Alloy
ICA-308-SGG
CONN IC DIP SOCKET 8POS GOLD
1+
¥27.0000
5+
¥25.5000
10+
¥24.0000
数量
1,465 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
ICA
Through Hole
Gold
Solder
Gold
Polyester, Glass Filled
-55°C ~ 125°C
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
30.0µin (0.76µm)
Beryllium Copper
Open Frame
0.100" (2.54mm)
30.0µin (0.76µm)
Brass
820-AG11D-ESL-LF
1+
¥18.3060
5+
¥17.2890
10+
¥16.2720
数量
1,132 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
800
Through Hole
Gold
Solder
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Flash
Beryllium Copper
Open Frame
0.100" (2.54mm)
Flash
Copper
110-87-632-41-001101
CONN IC DIP SOCKET 32POS GOLD
1+
¥28.2600
5+
¥26.6900
10+
¥25.1200
数量
661 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
110
Through Hole
Gold
Solder
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Flash
Beryllium Copper
Open Frame
0.100" (2.54mm)
-
Brass
5-1571552-0
CONN IC DIP SOCKET 32POS GOLD
1+
¥39.6000
5+
¥37.4000
10+
¥35.2000
数量
600 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
800
Through Hole
Gold
Solder
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
20.0µin (0.51µm)
Beryllium Copper
Open Frame
0.100" (2.54mm)
20.0µin (0.51µm)
Copper
917-93-103-41-005000
CONN TRANSIST TO-5 3POS GOLD
1+
¥17.8020
5+
¥16.8130
10+
¥15.8240
数量
500 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
917
Through Hole
Gold
Solder
Tin-Lead
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Transistor, TO-5
3 (Round)
-
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
-
200.0µin (5.08µm)
Brass Alloy

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。