BDN 系列, 散热器

结果:
14
Manufacturer
Series
Thermal Resistance @ Natural
Thermal Resistance @ Forced Air Flow
Length
Width
Fin Height
Attachment Method
Shape
Material
Type
Material Finish
Power Dissipation @ Temperature Rise
Diameter
Package Cooled
结果14
搜索条目:
BDN
选择
图片产品详情单价可用性ECAD 模型MaterialDiameterLengthWidthSeriesTypePackage CooledAttachment MethodShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
BDN18-6CB/A01
HEATSINK CPU W/ADHESIVE 1.81"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.810" (45.97mm)
1.810" (45.97mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.605" (15.37mm)
-
2.80°C/W @ 400 LFM
8.10°C/W
Black Anodized
BDN09-3CB/A01
HEATSINK CPU W/ADHESIVE .91"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
0.910" (23.11mm)
0.910" (23.11mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
9.60°C/W @ 400 LFM
26.90°C/W
Black Anodized
BDN10-3CB/A01
HEATSINK CPU W/ADHESIVE 1.01"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.010" (25.65mm)
1.010" (25.65mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
8.00°C/W @ 400 LFM
26.40°C/W
Black Anodized
BDN11-3CB/A01
HEATSINK CPU W/ADHESIVE 1.11"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.110" (28.19mm)
1.110" (28.19mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
7.20°C/W @ 400 LFM
20.90°C/W
Black Anodized
BDN12-5CB/A01
HEATSINK CPU W/ADHESIVE 1.21"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.210" (30.73mm)
1.210" (30.73mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.555" (14.10mm)
-
5.20°C/W @ 400 LFM
16.50°C/W
Black Anodized
BDN14-3CB/A01
HEATSINK CPU W/ADHESIVE 1.41"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.410" (35.81mm)
1.410" (35.81mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
5.60°C/W @ 400 LFM
16.20°C/W
Black Anodized
BDN18-3CB/A01
HEATSINK CPU W/ADHESIVE 1.81"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.810" (45.97mm)
1.810" (45.97mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
3.50°C/W @ 400 LFM
10.80°C/W
Black Anodized
BDN09-3CB
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
0.910" (23.11mm)
0.910" (23.11mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.355" (9.02mm)
-
9.60°C/W @ 400 LFM
26.90°C/W
Black Anodized
BDN13-3CB/A01
HEATSINK CPU W/ADHESIVE 1.31"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.310" (33.27mm)
1.310" (33.27mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
6.00°C/W @ 400 LFM
16.10°C/W
Black Anodized
BDN16-3CB/A01
HEATSINK CPU W/ADHESIVE 1.61"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.610" (40.89mm)
1.610" (40.89mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
4.50°C/W @ 400 LFM
13.50°C/W
Black Anodized
BDN10-5CB/A01
HEATSINK CPU W/ADHESIVE 1.01"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.010" (25.65mm)
1.010" (25.65mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.555" (14.10mm)
-
6.30°C/W @ 400 LFM
20.80°C/W
Black Anodized
BDN12-3CB/A01
HEATSINK CPU W/ADHESIVE 1.21"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.210" (30.73mm)
1.210" (30.73mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
6.80°C/W @ 400 LFM
19.60°C/W
Black Anodized
BDN15-3CB/A01
HEATSINK CPU W/ADHESIVE 1.51"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.510" (38.35mm)
1.510" (38.35mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
4.50°C/W @ 400 LFM
15.10°C/W
Black Anodized
BDN17-3CB/A01
HEATSINK CPU W/ADHESIVE 1.71"SQ
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Aluminum
-
1.710" (43.43mm)
1.710" (43.43mm)
BDN
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.355" (9.02mm)
-
3.80°C/W @ 400 LFM
11.50°C/W
Black Anodized

关于  散热器

被动式热交换器在散热电子元件产生的热量和维持其最佳工作温度方面发挥着至关重要的作用。这些设备将多余的热量传递给流体介质,通常是空气或液体冷却剂,有效地将其从元件中移除。 被动式热交换器的设计侧重于最大化热交换器与周围介质之间的接触表面积。通过增加表面积,可以更多地将热量传输并有效地散发出去。这通过各种设计要素实现,如突出于热交换器主体的翅片、脊线或扩展表面。这些特征通过提供额外的表面积,为热量传递到流体介质提供了可能。 为了确保有效的热量传递,被动式热交换器通常采用具有高导热性的材料,如铜或铝。这些材料可实现从电子元件到热交换器,然后再传递到周围介质的热量高效传输。由于铜和铝具有优异的热特性、轻巧的特点和经济实惠,它们被广泛采用。 根据应用和冷却要求的不同,被动式热交换器可以采用不同的形式。它们可以在各种电子系统中找到,包括计算机处理器、显卡、功率电子设备和LED照明等。热交换器的具体设计和配置可能会根据功率散发水平、可用空间和所需冷却性能等因素而有所变化。 总之,被动式热交换器是电子设备中至关重要的组件,它促进了电子元件产生的热量向流体介质的传递。它们的设计旨在最大化接触表面积,并通常使用具有高导热性的材料构建。通过高效地散发热量,这些热交换器有助于维持电子设备的最佳工作温度,确保其可靠性和寿命。