1183 系列, 胶带

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1183
选择
图片产品详情单价可用性ECAD 模型SeriesTemperature RangeColorAdhesiveTape TypeBacking, CarrierThicknessThickness - AdhesiveThickness - Backing, CarrierWidthLengthUsage
1183-7.7"X10"
TAPE 7.7"X10" SHEET 3" PAPER
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Acrylic
Copper Foil
Copper Foil
0.0027" (2.7 mils, 0.068mm)
0.0013" (1.3 mils, 0.033mm)
0.0014" (1.4 mils, 0.036mm)
7.70" (195.58mm)
10.00" (254.00mm)
EMI/RFI Shielding
1183-7.7"X10"
TAPE COPPER FOIL SILVER 7.7"X10"
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Acrylic
Copper Foil
Copper Foil
0.0027" (2.7 mils, 0.068mm)
0.0013" (1.3 mils, 0.033mm)
0.0014" (1.4 mils, 0.036mm)
7.70" (195.58mm)
10.00" (254.00mm)
EMI/RFI Shielding
1183 23"X72YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
-
-
-
-
-
-
-
-
-
-
1183 2.5"X18YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
2.50" (63.50mm) 2 1/2"
54' (16.5m) 18 yds
EMI Shielding
1183LOG 23"X18YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
23.00" (584.20mm)
54' (16.5m) 18 yds
EMI Shielding
1183 4.29"X36YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
4.27" (108.46mm)
108' (32.9m) 36 yds
EMI Shielding
1183 3.5"X36YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
3.50" (88.90mm) 3 1/2"
108' (32.9m) 36 yds
EMI Shielding
1183 3"X18YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
3.00" (76.20mm)
54' (16.5m) 18 yds
EMI Shielding
1183 1.5"X18YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
1.50" (38.10mm) 1 1/2"
54' (16.5m) 18 yds
EMI Shielding
1183 11.5"X18YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
11.50" (266.70mm) 11 1/2"
54' (16.5m) 18 yds
EMI Shielding
1183 C12MMX16,5MM
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
0.47" (12.00mm)
54' (16.5m) 18 yds
EMI Shielding
1183 25MMX165MMC9
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
0.98" (25.00mm)
54' (16.5m) 18 yds
EMI Shielding
1183 7.7X18YD
3M TIN-PLATED COPPER FOIL EMI SH
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
7.70" (195.58mm)
54' (16.5m) 18 yds
EMI Shielding
1183-23X18YD
TIN-PLATED CU FOIL 23"X18YD
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Acrylic
Copper Foil
Copper Foil
0.0027" (2.7 mils, 0.068mm)
0.0013" (1.3 mils, 0.033mm)
0.0014" (1.4 mils, 0.036mm)
23.00" (584.20mm)
54' (16.5m) 18 yds
EMI/RFI Shielding
1183 19MMX16,5M
3M POLYESTER FILM ELECTRICAL TAP
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数量
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PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
0.75" (19.05mm) 3/4"
54' (16.5m) 18 yds
EMI Shielding
1183 41MM X 50M
3M TIN-PLATED COPPER FOIL EMI SH
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数量
联系我们
PCB Symbol, Footprint & 3D Model
1183
-
Silver
Conductive Acrylic
Copper Foil
Copper Foil, Tin Plated
-
-
0.0014" (1.4 mils, 0.035mm)
1.63" (41.28mm) 1 5/8"
164' (50.0m) 54.7 yds
EMI Shielding

关于  胶带

胶带是一种单面或双面带有粘合剂的材料,用于在两个或多个物品之间建立粘合。 胶带的选择应根据所粘合的具体材料和所需的粘合强度进行定制。 不同类型的胶带按其类别(例如抗静电、电气、管道)、粘合剂成分(例如丙烯酸、环氧树脂、聚合物、橡胶)、背衬材料(包括丙烯酸、铝、纸)、尺寸和预期应用进行分类。