BERTECH® CFT 系列, 胶带
结果:
46
Manufacturer
Series
Width
Thickness - Adhesive
Color
Thickness - Backing, Carrier
Temperature Range
Usage
Backing, Carrier
Thickness
Length
Tape Type
Adhesive
结果：46
搜索条目:
BERTECH® CFT
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Color | Width | Adhesive | Series | Tape Type | Backing, Carrier | Thickness | Thickness - Adhesive | Thickness - Backing, Carrier | Length | Usage | Temperature Range |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Natural | 1.00" (25.40mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0011" (1.1 mils, 0.028mm) | 0.0015" (1.5 mils, 0.038mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 155°F (68.3°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 10.00" (254.00mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
.jpg "CFT-2") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Natural | 2.00" (50.80mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0011" (1.1 mils, 0.028mm) | 0.0015" (1.5 mils, 0.038mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 155°F (68.3°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 5.00" (127.00mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 6.00" (152.40mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 7.00" (177.80mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 8.00" (203.20mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 9.00" (228.60mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 5.91" (150.00mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 4.92" (125.00mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 5.50" (139.70mm) 5 1/2" | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 3.94" (100.00mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 2.95" (75.00mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 2.25" (57.15mm) 2 1/4" | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 1.63" (41.28mm) 1 5/8" | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 1.50" (38.10mm) 1 1/2" | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 1.25" (31.75mm) 1 1/4" | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.98" (25.00mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 1.13" (28.58mm) 1 1/8" | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.59" (15.00mm) | Acrylic | BERTECH® CFT | Copper Foil | Copper Foil | 0.0026" (2.6 mils, 0.066mm) | 0.0013" (1.3 mils, 0.033mm) | 0.0013" (1.3 mils, 0.033mm) | 108' (32.9m) 36 yds | EMI/RFI Shielding | 266°F (130°C) |
关于 胶带
胶带是一种单面或双面带有粘合剂的材料，用于在两个或多个物品之间建立粘合。 胶带的选择应根据所粘合的具体材料和所需的粘合强度进行定制。 不同类型的胶带按其类别（例如抗静电、电气、管道）、粘合剂成分（例如丙烯酸、环氧树脂、聚合物、橡胶）、背衬材料（包括丙烯酸、铝、纸）、尺寸和预期应用进行分类。
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