Zynq® UltraScale+™ RFSoC Series, 片上系统 (SoC)

结果:
124
Manufacturer
Series
Peripherals
Supplier Device Package
Package / Case
Primary Attributes
Speed
Operating Temperature
Connectivity
Core Processor
Architecture
Flash Size
RAM Size
Grade
Qualification
结果124
搜索条目:
Zynq® UltraScale+™ RFSoC
选择
图片产品详情单价可用性ECAD 模型Operating TemperatureGradePackage / CaseSupplier Device PackageSpeedFlash SizeRAM SizePeripheralsSeriesArchitectureCore ProcessorConnectivityPrimary AttributesQualification
XCZU47DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
5+
¥5250.0000
10+
¥4900.0000
15+
¥4725.0000
数量
910 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU67DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
5+
¥10500.0000
10+
¥9800.0000
15+
¥9450.0000
数量
240 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
-
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
-
Zynq® UltraScale+™ RFSoC
-
XCZU47DR-2FFVG1517I
IC ZUP RFSOC A53 FPGA 1517BGA
5+
¥40500.0000
10+
¥37800.0000
15+
¥36450.0000
数量
186 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU49DR-2FFVF1760E
IC ZUP RFSOC A53 FPGA 1760BGA
5+
¥150000.0000
10+
¥140000.0000
15+
¥135000.0000
数量
100 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU49DR-L2FFVF1760I
IC ZUP RFSOC A53 FPGA LP 1760BGA
5+
¥48000.0000
10+
¥44800.0000
15+
¥43200.0000
数量
17 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU42DR-L1FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
500MHz, 1.2GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
-
XCZU49DR-2FFVF1760I
IC ZUP RFSOC A53 FPGA 1760BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-L1FFVG1517I
IC ZUP RFSOC A53 FPGA LP 1517BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
500MHz, 1.2GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-2FFVG1517E
IC ZUP RFSOC A53 FPGA 1517BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU48DR-1FSVG1517I
IC ZUP RFSOC A53 FPGA 1517BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
500MHz, 1.2GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU46DR-2FSVH1760I
IC ZUP RFSOC A53 FPGA 1760BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-2FSVG1517I
IC ZUP RFSOC A53 FPGA 1517BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-L2FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-L2FSVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU46DR-L1FFVH1760I
IC ZUP RFSOC A53 FPGA LP 1760BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
500MHz, 1.2GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU46DR-2FSVH1760E
IC ZUP RFSOC A53 FPGA 1760BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-L2FFVG1517I
IC ZUP RFSOC A53 FPGA LP 1517BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU47DR-L2FFVG1517I
IC ZUP RFSOC A53 FPGA LP 1517BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU47DR-L2FSVG1517I
IC ZUP RFSOC A53 FPGA LP 1517BGA
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-

关于  片上系统 (SoC)

片上系统(SoC)是指将计算机系统的各种组件集成到一颗芯片上的集成电路。它通常包括处理器核心、存储器、输入输出接口和其他必要的外设,以支持系统的运作。SoC技术使得嵌入式系统变得紧凑、功耗低且高度集成。 功能和特点:SoC将多个系统组件集成到一颗芯片中,以紧凑的形态提供完整的解决方案。它们通常包括处理器核心,如ARM Cortex-A系列或RISC-V核心,以及存储器单元(RAM和/或闪存)、输入输出接口(USB、以太网、UART等)、定时器、中断、模数转换器(ADC)和其他特定应用所需的外设。SoC可以根据应用需求进行定制和编程,以执行各种功能。 使用场景:SoC广泛应用于对空间、功耗效率和集成度要求较高的嵌入式系统中。它们在众多场景中发挥作用,包括消费电子(智能手机、平板电脑、智能电视)、汽车系统(信息娱乐、发动机控制、高级驾驶辅助系统)、工业自动化、医疗设备、物联网设备等。SoC能够开发功能丰富、紧凑、具有成本效益的嵌入式系统。 应用领域:SoC在各个行业和领域中被广泛应用。在消费电子领域,SoC为智能手机、平板电脑、可穿戴设备和家用电器提供动力。汽车系统依赖SoC实现车载娱乐、导航和安全功能。工业自动化利用SoC进行控制系统、机器人和监测设备。医疗设备,如植入式设备和诊断工具,受益于SoC提供的紧凑性和集成性。SoC在物联网设备中也起着重要作用,实现了连接性、传感器集成和智能处理。 关键优势: 集成度:SoC将多个系统组件集成到一颗芯片中,减小了尺寸、复杂度和功耗。 紧凑性:将各种组件组合到一颗芯片上,实现了紧凑和便携的嵌入式系统。 功耗效率:SoC设计优化了功耗,适用于电池供电和节能应用。 可定制性:SoC可以定制和编程,以满足特定的应用需求,提供灵活性和适应性。 成本效益:SoC通过将多个组件集成到一颗芯片上,减少了对额外硬件的需求,提供了经济实惠的解决方案。 总而言之,嵌入式系统片上系统(SoC)是将多个系统组件集成到一颗芯片上的集成电路。SoC具有紧凑性、功耗低、可定制性和成本效益等特点,非常适用于各行业中各种嵌入式系统应用。