焊料
结果:
1,741
Manufacturer
Series
Form
Composition
Melting Point
Diameter
Wire Gauge
Storage/Refrigeration Temperature
Flux Type
Type
Shelf Life
Mesh Type
Process
Shelf Life Start
Cable Type
Shield Type
Jacket (Insulation) Material
Ratings
Voltage
Conductor Material
Features
Number of Conductors
Operating Temperature
Usage
Jacket (Insulation) Thickness
Grade
Qualification
Length
Conductor Strand
Jacket Color
Jacket (Insulation) Diameter
结果：1,741
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Shelf Life | Shelf Life Start | Series | Mesh Type | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Process | Form | Storage/Refrigeration Temperature |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 44 | - | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Leaded | Spool, 17.64 oz (500g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | SMD | - | Solder Shot | Bi100(100) | - | 521°F (271°C) | - | - | Lead Free | Bag, 1 oz (28g) | - | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 245 | - | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 30 AWG, 33 SWG | Lead Free | Spool, 3.53 oz (100g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 268 | - | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 AWG | Leaded | Spool, 17.64 oz (500g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 12 Months | Date of Manufacture | - | 3 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Syringe, 0.53 oz (15g), 5cc | 37°F ~ 46°F (3°C ~ 8°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 6 Months | Date of Manufacture | Smooth Flow™ | 4 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Jar, 1.76 oz (50g) | 37°F ~ 46°F (3°C ~ 8°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 6 Months | Date of Manufacture | Smooth Flow™ | 4 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Syringe, 0.53 oz (15g), 5cc | 37°F ~ 46°F (3°C ~ 8°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 12 Months | Date of Manufacture | Smooth Flow™ | 4 | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | - | Syringe, 0.53 oz (15g), 5cc | 37°F ~ 46°F (3°C ~ 8°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 275 | - | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | Spool, 17.64 oz (500g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 331 | - | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | Spool, 17.64 oz (500g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 6 Months | Date of Manufacture | CHIPQUIK® SMD4300 | 3 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Syringe, 1.23 oz (35g), 10cc | 37°F ~ 46°F (3°C ~ 8°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 44 | - | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | Spool, 17.64 oz (500g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 12 Months | Date of Manufacture | CHIPQUIK® | 3 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | - | Syringe, 1.23 oz (34.869g) | 37°F ~ 77°F (3°C ~ 25°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 12 Months | Date of Manufacture | CHIPQUIK® | 4 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Syringe, 1.23 oz (34.869g) | 37°F ~ 77°F (3°C ~ 25°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | Spool, 1 lb (454 g) | - | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | SMD2 | - | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.012" (0.31mm) | 441°F (227°C) | No-Clean, Water Soluble | 28 AWG, 30 SWG | Lead Free | Spool, 3.53 oz (100g) | - | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | SUPER-PURE™ | - | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Bar, 1 lb (454g) | - | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 12 Months | Date of Manufacture | CHIPQUIK® SMD4300 | 5 | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | Syringe, 1.23 oz (35g), 10cc | 37°F ~ 46°F (3°C ~ 8°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 12 Months | Date of Manufacture | - | 4 | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | Lead Free | Syringe, 1.23 oz (35g), 10cc | 68°F ~ 77°F (20°C ~ 25°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | CHIPQUIK® | - | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | Leaded | Spool, 4 oz (113.40g) | - |
焊料
焊料是指专门设计用于将金属表面连接在一起的金属合金。有各种类型的焊料可用于不同的应用场景。包括条状焊料、带状焊料、焊膏、焊丸、焊球和焊线。焊料的直径范围从0.006英寸（0.15毫米）到0.250英寸（6.35毫米），以满足不同的焊接需求。 焊料的熔点因具体合金组成而异。它的熔点范围从244°F（118°C）到1983°F（1084°C）。焊料有无铅和含铅两种选择，以满足环境考虑的需求。 除了不同的焊料类型外，还有各种用于与焊料配合使用的助焊剂。助焊剂有助于去除氧化物和杂质，使焊料能够与金属表面正确结合。助焊剂的类型包括酸芯、无清洁型、松香活性型、松香轻度活性型和水溶性型。每种助焊剂都具有不同的特性，适用于特定的焊接应用。 通过选择适当的焊料类型、直径、熔点和助焊剂类型，技术人员可以确保成功和可靠的金属连接过程。在选择适当的焊料和助焊剂组合时，需要考虑具体的应用要求和环境因素。
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