CHIPQUIK® 系列, 焊料
结果:
58
Manufacturer
Series
Form
Composition
Melting Point
Diameter
Shelf Life
Type
Storage/Refrigeration Temperature
Process
Flux Type
Mesh Type
Shelf Life Start
Wire Gauge
结果：58
搜索条目:
CHIPQUIK®
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Series | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Wire Gauge | Mesh Type | Type | Composition | Diameter | Melting Point | Flux Type | Process | Form |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | - | - | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | - | Tube, 0.2 oz (5.66g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | - | - | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | Leaded | Tube, 0.2 oz (5.66g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | - | - | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | Leaded | Spool, 4 oz (113.40g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | - | - | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | Leaded | Spool, 8 oz (226.80g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | 4 | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | Leaded | Syringe, 1.23 oz (34.869g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | 4 | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | Syringe, 1.23 oz (34.869g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | 4 | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | Water Soluble | - | Syringe, 1.23 oz (34.869g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | 4 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | Syringe, 1.23 oz (34.869g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | 3 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | Syringe, 1.23 oz (34.869g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | 4 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | Syringe, 1.23 oz (34.869g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | - | - | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Spool, 1 lb (453.592g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | - | - | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | - | Spool, 1 lb (453.592g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 6 Months | Date of Manufacture | - | - | 4 | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | Leaded | Jar, 17.64 oz (500g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | - | - | 4 | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | Leaded | Jar, 17.64 oz (500g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | - | - | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Spool, 8 oz (226.80g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | - | - | 4 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | Lead Free | Jar, 17.64 oz (500g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 6 Months | Date of Manufacture | - | - | 4 | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | Water Soluble | Lead Free | Jar, 17.64 oz (500g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 12 Months | Date of Manufacture | - | - | 3 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | Lead Free | Jar, 17.64 oz (500g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | 6 Months | Date of Manufacture | - | - | 4 | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | Lead Free | Jar, 17.64 oz (500g) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | - | - | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | Leaded | Spool, 1 oz (28.35g) |
关于 焊料
焊料是指专门设计用于将金属表面连接在一起的金属合金。有各种类型的焊料可用于不同的应用场景。包括条状焊料、带状焊料、焊膏、焊丸、焊球和焊线。焊料的直径范围从0.006英寸（0.15毫米）到0.250英寸（6.35毫米），以满足不同的焊接需求。 焊料的熔点因具体合金组成而异。它的熔点范围从244°F（118°C）到1983°F（1084°C）。焊料有无铅和含铅两种选择，以满足环境考虑的需求。 除了不同的焊料类型外，还有各种用于与焊料配合使用的助焊剂。助焊剂有助于去除氧化物和杂质，使焊料能够与金属表面正确结合。助焊剂的类型包括酸芯、无清洁型、松香活性型、松香轻度活性型和水溶性型。每种助焊剂都具有不同的特性，适用于特定的焊接应用。 通过选择适当的焊料类型、直径、熔点和助焊剂类型，技术人员可以确保成功和可靠的金属连接过程。在选择适当的焊料和助焊剂组合时，需要考虑具体的应用要求和环境因素。
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