OR421 Series, 焊料

结果:
12
Manufacturer
Series
Composition
Melting Point
Wire Gauge
Diameter
Form
Process
Storage/Refrigeration Temperature
Flux Type
Type
Mesh Type
Shelf Life Start
Shelf Life
结果12
搜索条目:
OR421
选择
图片产品详情单价可用性ECAD 模型Shelf LifeShelf Life StartMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
24-6337-0652
SOLDER FLUX-CORED/OR421 63/37 .0
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn63Pb37 (63/37)
0.040" (1.02mm)
361°F (183°C)
Water Soluble
18 AWG, 19 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6337-0657
SOLDER FLUX-CORED/OR421 63/37.03
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
Water Soluble
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-7012-0655
SOLDER FLUX-CORED/OR421 .062" 1L
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.062" (1.57mm)
441°F (227°C)
Water Soluble
14 AWG, 16 SWG
Lead Free
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-7038-0673
SOLDER FLUX-CORED/OR421.031" 1LB
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn97Cu3 (97/3)
0.031" (0.79mm)
-
Water Soluble
20 AWG, 22 SWG
Lead Free
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-7080-0634
SOLDER FLUX-CORED/OR421 .032 1LB
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn95Sb5 (95/5)
0.032" (0.81mm)
450 ~ 464°F (232 ~ 240°C)
Water Soluble
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
25-7068-0674
SOLDER FLUX-CORED/OR421 .086 4 L
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.086" (2.18mm)
423 ~ 424°F (217 ~ 218°C)
Water Soluble
11 AWG, 14 SWG
Lead Free
Spool, 4 lbs (1.81kg)
50°F ~ 104°F (10°C ~ 40°C)
27-7050-0655
SOLDER FLUX-CORED/OR421 .062" 18
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn96.3Ag3.7 (96.3/3.7)
0.062" (1.57mm)
430 ~ 444°F (221 ~ 223°C)
Water Soluble
14 AWG, 16 SWG
Lead Free
Spool, 18 lbs (8.16kg)
50°F ~ 104°F (10°C ~ 40°C)
27-9574-0654
SOLDER FLUX-CORED/OR421 .062" 18
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.062" (1.57mm)
441°F (227°C)
Water Soluble
14 AWG, 16 SWG
Lead Free
Spool, 18 lbs (8.16kg)
50°F ~ 104°F (10°C ~ 40°C)
28-5050-0654
SOLDER FLUX-CORED/OR421 .062" 20
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn50Pb50 (50/50)
0.062" (1.57mm)
361 ~ 420°F (183 ~ 216°C)
Water Soluble
14 AWG, 16 SWG
Leaded
Spool, 20 lbs (9.07kg)
50°F ~ 104°F (10°C ~ 40°C)
25-9574-0654
SOLDER FLUX-CORED/OR421 .062"4LB
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.062" (1.57mm)
441°F (227°C)
Water Soluble
14 AWG, 16 SWG
Lead Free
Spool, 4 lbs (1.81kg)
50°F ~ 104°F (10°C ~ 40°C)
28-4060-0665
SOLDER FLUX-CORED/OR421 .072" 20
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数量
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PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Pb60Sn40 (60/40)
0.072" (1.83mm)
361 ~ 460°F (183 ~ 238°C)
Water Soluble
13 AWG, 15 SWG
Leaded
Spool, 20 lbs (9.07kg)
50°F ~ 104°F (10°C ~ 40°C)
27-7080-0661
SOLDER FLUX-CORED/OR421 .062" 18
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-
-
OR421
Wire Solder
Sn95Sb5 (95/5)
0.062" (1.57mm)
450 ~ 464°F (232 ~ 240°C)
Water Soluble
14 AWG, 16 SWG
Lead Free
Spool, 18 lbs (8.16kg)
50°F ~ 104°F (10°C ~ 40°C)

关于  焊料

焊料是指专门设计用于将金属表面连接在一起的金属合金。有各种类型的焊料可用于不同的应用场景。包括条状焊料、带状焊料、焊膏、焊丸、焊球和焊线。焊料的直径范围从0.006英寸(0.15毫米)到0.250英寸(6.35毫米),以满足不同的焊接需求。 焊料的熔点因具体合金组成而异。它的熔点范围从244°F(118°C)到1983°F(1084°C)。焊料有无铅和含铅两种选择,以满足环境考虑的需求。 除了不同的焊料类型外,还有各种用于与焊料配合使用的助焊剂。助焊剂有助于去除氧化物和杂质,使焊料能够与金属表面正确结合。助焊剂的类型包括酸芯、无清洁型、松香活性型、松香轻度活性型和水溶性型。每种助焊剂都具有不同的特性,适用于特定的焊接应用。 通过选择适当的焊料类型、直径、熔点和助焊剂类型,技术人员可以确保成功和可靠的金属连接过程。在选择适当的焊料和助焊剂组合时,需要考虑具体的应用要求和环境因素。