285 Series, 焊料
结果:
77
Manufacturer
Series
Wire Gauge
Diameter
Composition
Melting Point
Form
Shelf Life
Process
Flux Type
Shelf Life Start
Storage/Refrigeration Temperature
Type
Mesh Type
结果：77
搜索条目:
285
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Shelf Life | Shelf Life Start | Series | Mesh Type | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Process | Form | Storage/Refrigeration Temperature |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 285 | - | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 285 | - | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.062" (1.57mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Lead Free | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.031" (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 285 | - | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.015" (0.38mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | Spool, 8.8 oz (250g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Pb95Sn5 (95/5) | 0.031" (0.79mm) | 574 ~ 597°F (301 ~ 314°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 285 | - | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Sn95Sb5 (95/5) | 0.050" (1.27mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 16 AWG, 18 SWG | Lead Free | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 285 | - | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 285 | - | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 285 | - | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 24 Months | Date of Manufacture | 285 | - | Wire Solder | Pb88Sn10Ag2 (88/10/2) | 0.040" (1.02mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 18 AWG, 19 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 36 Months | Date of Manufacture | 285 | - | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.015" (0.38mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Pb88Sn10Ag2 (88/10/2) | 0.031" (0.79mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Pb88Sn10Ag2 (88/10/2) | 0.031" (0.79mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 285 | - | Wire Solder | Sn95Sb5 (95/5) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Lead Free | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) |
关于 焊料
焊料是指专门设计用于将金属表面连接在一起的金属合金。有各种类型的焊料可用于不同的应用场景。包括条状焊料、带状焊料、焊膏、焊丸、焊球和焊线。焊料的直径范围从0.006英寸（0.15毫米）到0.250英寸（6.35毫米），以满足不同的焊接需求。 焊料的熔点因具体合金组成而异。它的熔点范围从244°F（118°C）到1983°F（1084°C）。焊料有无铅和含铅两种选择，以满足环境考虑的需求。 除了不同的焊料类型外，还有各种用于与焊料配合使用的助焊剂。助焊剂有助于去除氧化物和杂质，使焊料能够与金属表面正确结合。助焊剂的类型包括酸芯、无清洁型、松香活性型、松香轻度活性型和水溶性型。每种助焊剂都具有不同的特性，适用于特定的焊接应用。 通过选择适当的焊料类型、直径、熔点和助焊剂类型，技术人员可以确保成功和可靠的金属连接过程。在选择适当的焊料和助焊剂组合时，需要考虑具体的应用要求和环境因素。
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