插座适配器

结果:
276
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
结果276
选择
图片产品详情单价可用性ECAD 模型Mounting TypeSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
08-666000-00
SOCKET ADAPTER SOIC TO 8SOWIC
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数量
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PCB Symbol, Footprint & 3D Model
Surface Mount
Correct-A-Chip® 666000
SOIC
SOWIC
8
0.050" (1.27mm)
-
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
20-301550-10
SOCKET ADAPTER SOIC TO 20PLCC
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 301550
SOIC
PLCC
20
0.050" (1.27mm)
-
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
10-350000-10-HT
SOCKET ADAPTER SOIC TO 10DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 350000
SOIC
DIP, 0.3" (7.62mm) Row Spacing
10
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
20-555000-00
SOCKET ADAPTER SSOP/SOWIC 20POS
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数量
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PCB Symbol, Footprint & 3D Model
Surface Mount
Correct-A-Chip® 555000
SSOP
SOWIC
20
0.026" (0.65mm)
-
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
18-665000-00
SCK ADAPT 18P SOIC-W TO SOIC 0.6
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数量
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PCB Symbol, Footprint & 3D Model
Surface Mount
Correct-A-Chip® 665000
SOIC-W
SOIC
18
0.050" (1.27mm)
-
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
1106396-36
SOCKET ADAPTER DIP TO 36DIP 0.6
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 1106396
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
36
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-305479-10
SOCKET ADAPTER SOIC TO TO-8
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 305479
SOIC
JEDEC
8
0.050" (1.27mm)
-
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
08-301296-10
SOCKET ADAPTER SOIC TO TO-8
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 301296
SOIC
JEDEC
8
0.050" (1.27mm)
-
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
14-350000-10-HT
SOCKET ADAPTER SOIC TO 14DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 350000
SOIC
DIP, 0.3" (7.62mm) Row Spacing
14
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
44-505-111
SOCKET ADAPTER PLCC TO 44PGA
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 505
PLCC
PGA
44
0.050" (1.27mm)
-
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
68-505-110-P
SOCKET ADAPTER PLCC TO 68PGA
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 505
PLCC
PGA
68
0.050" (1.27mm)
-
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
08-350000-10-HT
SOCKET ADAPTER SOIC TO 8DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 350000
SOIC
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
216-3340-09-0602J
SOCKET ADAPTER 16DIP TO 16DIP
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
16
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
96-080M80
SOCKET ADAPTER QFP TO 80PGA
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
-
QFP
PGA
80
0.031" (0.80mm)
Tin
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
97-68340
SOCKET ADAPTER QFP TO 144PGA
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 97-68340
QFP
PGA
144
0.026" (0.65mm)
Tin
Solder
0.100" (2.54mm)
Tin
-
FR4 Epoxy Glass
218-3341-09-0602J
SOCKET ADAPTER 18DIP TO 18DIP
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
44-647-10
SOCKET ADAPTER SOIC TO 44DIP 0.6
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
647
SOIC
DIP, 0.6" (15.24mm) Row Spacing
44
-
Gold
Solder
-
Tin
-
-
08-354000-21-RC
SOCKET ADAPTER DIP TO 8SOIC
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数量
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PCB Symbol, Footprint & 3D Model
Surface Mount
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
8
0.100" (2.54mm)
Gold
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
48-655000-10
SOCKET ADAPTER TSOP TO 48DIP 0.6
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数量
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PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 655000
TSOP
DIP, 0.6" (15.24mm) Row Spacing
48
0.020" (0.50mm)
Silver
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
68-505-110-RC-P
SOCKET ADAPTER PLCC TO 68PGA
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
Correct-A-Chip® 505
PLCC
PGA
68
0.050" (1.27mm)
-
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass

关于  插座适配器

插座在电子电路中起着至关重要的作用,它使集成电路(IC)和晶体管能够反复插入、拆卸、替换和更换。插座提供了一个灵活的接口,便于不同封装类型的顺畅集成,确保电子系统设计和维护的灵活性和适应性。 插座适配器是有价值的附件,通过允许使用为一种封装类型设计的元件来替代另一种封装类型,扩展了IC和晶体管的兼容性和互换性。这种能力增强了电子系统的多功能性,并简化了现有电路设计的升级或修改过程。 例如,插座适配器可以将8引脚双列直插封装(DIP)适配为联合电子设备工程委员会(JEDEC)插座封装,提供了不同封装标准之间的桥梁,便于元件的互换使用。 此外,插座适配器支持将流行的表面贴装和通孔封装类型(如球栅阵列封装(BGA)、塑料引线芯片载体(PLCC)、四面体平封装(QFP)、小外形集成电路(SOIC)和收缩小外形集成电路(SOWIC))转换为DIP和JEDEC格式。这种广泛的兼容性确保了各种IC和晶体管可以集成到电子电路中,无论其原始封装设计如何。 通过提供在不同封装类型之间无缝适应的能力,插座适配器使设计师和工程师能够优化元件选择和利用,从而提高电子系统的灵活性和寿命。这种适应性有助于实现高效的系统维护、升级和在各种电子应用中的兼容性。