插座适配器

结果:
276
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
结果276
选择
图片产品详情单价可用性ECAD 模型SeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
228-1277-19-0602J
RECEPTACLE DIP SOCKET 28POS .6"
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数量
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
LCQT-QFP0.5-60
SOCKET ADAPTER MULT PKG TO 60QFP
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Multiple Packages
QFP
60
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
LCQT-QFP0.5-40-1
SOCKET ADAPTER MULT PKG TO 40QFP
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Multiple Packages
QFP
40
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
1107254-20
SOCKET ADAPTER DIP TO 20DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-18
SOCKET ADAPTER DIP TO 18DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1106396-20
SOCKET ADAPTER DIP TO 20DIP 0.6
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1106396
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-14
SOCKET ADAPTER DIP TO 14DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
14
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1111841-8
SOCKET ADAPTER MSOP TO 8DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1111841
MSOP
DIP, 0.3" (7.62mm) Row Spacing
8
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
218-3341-19-0602J
RECEPTACLE DIP SOCKET 18POS .3"
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数量
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-1280-19-0602J
RECEPTACLE DIP SOCKET 40POS .6"
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数量
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
12-665000-00
SCK ADAPT 12P SOIC-W TO SOIC 0.6
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
12
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
220-3342-19-0602J
RECEPTACLE DIP SOCKET 20POS .3"
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
214-3339-09-0602J
SOCKET ADAPTER 14DIP TO 14DIP
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数量
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
14
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
264-4493-19-0602J
RECEPTACLE DIP SOCKET 64POS .9"
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数量
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.9" (22.86mm) Row Spacing
DIP, 0.9" (22.86mm) Row Spacing
64
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-1275-19-0602J
RECEPTACLE DIP SOCKET 24POS .6"
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
18-354000-11-RC
SOCKET ADAPTER DIP TO 18SOIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
18
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-35W000-11-RC
SOCKET ADAPT SOIC-W TO 14DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
14
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
22-304504-18
SOCKET ADAPTER SOIC TO 22DIP 0.4
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 304504
SOIC
DIP, 0.4" (10.16mm) Row Spacing
22
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
1111903
SOCKET ADAPT SOWIC TO 24DIP 0.4
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1111903
SOWIC
DIP, 0.4" (10.16mm) Row Spacing
24
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
26-665000-00
SCK ADAPT 26P SOIC-W TO SOIC 0.6
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
26
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass

插座适配器

插座在电子电路中起着至关重要的作用,它使集成电路(IC)和晶体管能够反复插入、拆卸、替换和更换。插座提供了一个灵活的接口,便于不同封装类型的顺畅集成,确保电子系统设计和维护的灵活性和适应性。 插座适配器是有价值的附件,通过允许使用为一种封装类型设计的元件来替代另一种封装类型,扩展了IC和晶体管的兼容性和互换性。这种能力增强了电子系统的多功能性,并简化了现有电路设计的升级或修改过程。 例如,插座适配器可以将8引脚双列直插封装(DIP)适配为联合电子设备工程委员会(JEDEC)插座封装,提供了不同封装标准之间的桥梁,便于元件的互换使用。 此外,插座适配器支持将流行的表面贴装和通孔封装类型(如球栅阵列封装(BGA)、塑料引线芯片载体(PLCC)、四面体平封装(QFP)、小外形集成电路(SOIC)和收缩小外形集成电路(SOWIC))转换为DIP和JEDEC格式。这种广泛的兼容性确保了各种IC和晶体管可以集成到电子电路中,无论其原始封装设计如何。 通过提供在不同封装类型之间无缝适应的能力,插座适配器使设计师和工程师能够优化元件选择和利用,从而提高电子系统的灵活性和寿命。这种适应性有助于实现高效的系统维护、升级和在各种电子应用中的兼容性。