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| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | Through Hole | - | PC Pin | DPDT (2 Form C) | -55°C ~ 85°C | 5VDC | - | Sealed - Hermetically | - | 3.8 VDC | - | 4 ms | 3 ms | Silver Palladium (AgPd), Gold (Au) | General Purpose | HC, CII | 1 A | - |
| | HC-12B = .100 GRID COMM RELAY | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | Through Hole | Non Latching | PC Pin | DPDT (2 Form C) | -55°C ~ 85°C | 12VDC | 28VDC - Max | Sealed - Hermetically | - | 8 VDC | 0.5 VDC | 6 ms | 6 ms | - | General Purpose | HC, CII | 1 A | 30 mA |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | Through Hole | - | PC Pin | DPDT (2 Form C) | -55°C ~ 85°C | 26.5VDC | - | Sealed - Hermetically | - | 18 VDC | - | 4 ms | 3 ms | Silver Palladium (AgPd), Gold (Au) | General Purpose | HC, CII | 1 A | - |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | Through Hole | - | PC Pin | DPDT (2 Form C) | -55°C ~ 85°C | 26.5VDC | - | Sealed - Hermetically | - | 18 VDC | - | 4 ms | 3 ms | Silver Palladium (AgPd), Gold (Au) | General Purpose | HC, CII | 1 A | - |