SMD Grounding Metallized 系列, RFI 和 EMI - 触头,簧片和衬垫

结果:
15
Manufacturer
Series
Height
Length
Width
Shape
Operating Temperature
Type
Plating - Thickness
Plating
Material
Attachment Method
结果15
搜索条目:
SMD Grounding Metallized
选择
图片产品详情单价可用性ECAD 模型Operating TemperatureHeightPlatingLengthWidthShapeSeriesTypeMaterialPlating - ThicknessAttachment Method
67SLG030030050PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.118" (3.00mm)
-
0.197" (5.00mm)
0.118" (3.00mm)
Rectangle
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLG040040025PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.157" (4.00mm)
-
0.098" (2.50mm)
0.157" (4.00mm)
Rectangle
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLG050050030PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.197" (5.00mm)
-
0.118" (3.00mm)
0.197" (5.00mm)
Rectangle
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLH050050025PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.197" (5.00mm)
-
0.098" (2.50mm)
0.197" (5.00mm)
Hourglass
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLG100100100PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.394" (10.00mm)
-
0.394" (10.00mm)
0.394" (10.00mm)
Rectangle
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLH050050030PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.197" (5.00mm)
-
0.118" (3.00mm)
0.197" (5.00mm)
Hourglass
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLH050050050PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.197" (5.00mm)
-
0.197" (5.00mm)
0.197" (5.00mm)
Hourglass
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLH060080070PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.315" (8.00mm)
-
0.276" (7.00mm)
0.236" (6.00mm)
Hourglass
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLH060080080PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.315" (8.00mm)
-
0.315" (8.00mm)
0.236" (6.00mm)
Hourglass
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLG040035030PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.138" (3.50mm)
-
0.118" (3.00mm)
0.157" (4.00mm)
Rectangle
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLH080080080PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.315" (8.00mm)
-
0.315" (8.00mm)
0.315" (8.00mm)
Hourglass
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLG100150100PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.591" (15.00mm)
-
0.394" (10.00mm)
0.394" (10.00mm)
Rectangle
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLG060080070PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.315" (8.00mm)
-
0.276" (7.00mm)
0.236" (6.00mm)
Rectangle
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLH060100050PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.394" (10.00mm)
-
0.197" (5.00mm)
0.236" (6.00mm)
Hourglass
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder
67SLG050060050PI00
METAL FILM OVER FOAM CONTACTS
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
0.236" (6.00mm)
-
0.197" (5.00mm)
0.197" (5.00mm)
Rectangle
SMD Grounding Metallized
Film Over Foam
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
-
Solder

关于  RFI 和 EMI - 触头,簧片和衬垫

指簧片和垫圈接触件是用于减轻电磁干扰(EMI),也称为射频干扰(RFI),尤其在射频频谱范围内发生时的组件。通过电磁感应、静电耦合或传导,EMI可能对电路产生负面影响。这些接触件通常用于情况,在这种情况下,机箱或外壳的部件或门可拆卸,使其容易受到EMI的影响。 可以使用各种方法来连接这些接触件,包括粘合剂、夹子、硬件、焊接、槽口或卡入通道。选择连接方法取决于特定应用的要求和所涉及的材料。 指簧片接触件由导电金属条制成,呈“U”形或“V”形,在安装到表面时形成弹簧状结构。这些接触件通过在两个表面之间创建导电路径并保持低阻抗连接,实现了有效的接地和屏蔽EMI的功能。 另一方面,垫圈接触件利用导电弹性体材料或金属网片安装在两个表面之间。这种材料创建了一个密封紧密的垫片,防止EMI通过两个表面之间的缝隙传递。垫圈接触件通常用于需要环境密封以及EMI保护的应用中。 总之,指簧片和垫圈接触件是在电路中限制电磁干扰(EMI)的关键组件。凭借其不同的结构和连接方法,它们提供了有效的接地和屏蔽能力,以保持信号完整性并确保可靠的系统运行。