MTJ 系列, 模块化连接器磁性插孔
结果:
45
Manufacturer
Series
Height Above Board
LED Color
Number of Cores per Jack
Operating Temperature
Features
Tab Direction
Number of Ports
Number of Rows
Shielding
Connector Type
Contact Material
Mounting Type
Orientation
Applications
Contact Finish
Termination
结果：45
搜索条目:
MTJ
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Mounting Type | Termination | Shielding | Contact Finish | Applications | Contact Material | Number of Ports | Features | Connector Type | Number of Rows | Height Above Board | Series | Orientation | LED Color | Number of Cores per Jack | Tab Direction |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Through Hole | Solder | Shielded | Gold | - | Phosphor Bronze | 1 | Board Lock, Solder Retention | Jack | 1 | 0.445" (11.30mm) | MTJ | 90° Angle (Right) | Does Not Contain LED | 8 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 125°C | Through Hole | Solder | Shielded | Gold | - | Copper Alloy | 1 | Board Guide, Solder Retention | Jack | 1 | 0.531" (13.49mm) | MTJ | 90° Angle (Right) | Does Not Contain LED | 4 | Down | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Through Hole | Solder | Shielded | Gold | - | Phosphor Bronze | 1 | Board Lock, Solder Retention | RJ45 with USB A, Dual | 1 | 1.220" (31.00mm) | MTJ | 90° Angle (Right) | Green - Yellow | 8 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Phosphor Bronze | 8 | Board Guide, Solder Retention | RJ45 with USB A, Dual | 2 | 1.220" (31.00mm) | MTJ | 90° Angle (Right) | Green, Yellow - Green, Yellow | 9 | Up and Down | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Copper Alloy | 2 | Board Guide, Solder Retention | Jack | 1 | 0.531" (13.49mm) | MTJ | 90° Angle (Right) | Green - Yellow | 4 | Down | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Phosphor Bronze | 1 | Board Lock, Solder Retention | RJ45 with USB A | 1 | 0.829" (21.06mm) | MTJ | 90° Angle (Right) | Orange, Green - Yellow | 4 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Through Hole | Solder | Shielded | Gold | - | Phosphor Bronze | 1 | Board Lock, Solder Retention | Jack | 1 | 0.445" (11.30mm) | MTJ | 90° Angle (Right) | Green, Orange - Yellow | 8 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Phosphor Bronze | 1 | Board Guide, Solder Retention | Jack | 1 | 0.445" (11.30mm) | MTJ | 90° Angle (Right) | Green, Orange - Yellow | 4 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Through Hole | Solder | Shielded | Gold | - | Phosphor Bronze | 1 | Board Lock, Solder Retention | Jack | 1 | - | MTJ | Vertical | Green - Yellow | - | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Copper Alloy | 1 | Board Lock, Solder Retention | Jack | 1 | 0.543" (13.80mm) | MTJ | 90° Angle (Right) | Yellow - Green | 4 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Phosphor Bronze | 1 | Board Lock, Solder Retention | Jack | 1 | 0.531" (13.49mm) | MTJ | 90° Angle (Right) | Yellow - Green | 4 | Down | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Copper Alloy | 4 | Board Guide, Solder Retention | Jack | 1 | 0.531" (13.49mm) | MTJ | 90° Angle (Right) | Green - Yellow | 4 | Down | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Unshielded | Gold | - | Phosphor Bronze | 1 | Board Lock, Solder Retention | Jack | 1 | 0.531" (13.49mm) | MTJ | 90° Angle (Right) | Green - Yellow | 4 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Unshielded | Gold | - | Phosphor Bronze | 1 | Board Lock | Jack | 1 | 1.014" (25.75mm) | MTJ | 90° Angle (Right) | Green - Yellow | 8 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Surface Mount | Solder | Shielded | Gold | - | Copper Alloy | 1 | Board Guide, Solder Retention | Jack | 1 | 0.535" (13.59mm) | MTJ | 90° Angle (Right) | Does Not Contain LED | 4 | Down | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | Through Hole | Solder | Unshielded | Gold | - | Phosphor Bronze | 1 | Board Lock | Jack | 1 | 0.502" (12.75mm) | MTJ | 90° Angle (Right) | Green - Yellow | 4 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Phosphor Bronze | 1 | Board Lock, Solder Retention | Jack | 1 | 0.531" (13.49mm) | MTJ | 90° Angle (Right) | Green - Green, Yellow | 8 | Up | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Copper Alloy | 1 | Board Guide, Solder Retention | Jack | 1 | 0.531" (13.49mm) | MTJ | 90° Angle (Right) | Green - Yellow | 4 | Down | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Through Hole | Solder | Shielded, EMI Finger | Gold | - | Copper Alloy | 1 | Board Guide, Solder Retention | Jack | 1 | 0.531" (13.49mm) | MTJ | 90° Angle (Right) | Green - Yellow | 4 | Down | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Surface Mount | Solder | Shielded | Gold | - | Copper Alloy | 1 | Board Guide, Solder Retention | Jack | 1 | 0.536" (13.61mm) | MTJ | 90° Angle (Right) | Does Not Contain LED | 4 | Down |
关于 模块化连接器磁性插孔
模块化连接器是一类在有线信息和电信网络中广泛使用的标准化互连产品。这些连接器分为两种类型：带有集成磁性元件的插座/插头，用于高速应用，如以太网；以及不带集成磁性元件的插头和插座/插头，用于低速应用，如语音网络。 带有集成磁性元件的模块化连接器通常被称为 "magjacks" 或 "模块化插座"。这些连接器将常见高速应用（如以太网）所需的磁性元件集成到连接器本身中。这种集成减少了所需的外部元件数量，简化了设计并降低了成本。 另一方面，不带集成磁性元件的模块化插头和插座/插头通常用于低速应用，如语音网络。由于其不同的设计和性能要求，这些连接器被单独编目。 总体而言，模块化连接器为有线信息和电信网络中的设备和系统提供了一种多功能且标准化的解决方案。某些连接器中集成磁性元件进一步简化了高速应用的设计和实施。
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