S32G3 Series, 微处理器
结果:
25
Manufacturer
Series
Speed
Number of Cores/Bus Width
Security Features
Additional Interfaces
RAM Controllers
Core Processor
Display & Interface Controllers
Operating Temperature
USB
Grade
Mounting Type
Supplier Device Package
Qualification
Package / Case
Ethernet
Voltage - I/O
Graphics Acceleration
SATA
Co-Processors/DSP
结果：25
搜索条目:
S32G3
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Mounting Type | Operating Temperature | Voltage - I/O | Grade | Core Processor | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Package / Case | Supplier Device Package | Ethernet | Number of Cores/Bus Width | Speed | Security Features | Qualification | Series | Additional Interfaces |
|---|
 | 5+ $1557.0000 10+ $1453.2000 15+ $1401.3000 更多的价格 | 625 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 3 Core, 64-Bit/8 Core, 32-Bit | 1.1GHz, 400MHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 64-Bit/8 Core, 32-Bit | 1.1GHz, 400MHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 3 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 3 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 3 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1GHz | ARM TZ, Boot Security, TRNG | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 32/64-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1GHz | ARM TZ, Boot Security, TRNG | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 32/64-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 32/64-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 3 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1GHz | ARM TZ, Boot Security, TRNG | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 32/64-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 32/64-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 3 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1GHz | ARM TZ, Boot Security, TRNG | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 32/64-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 4 Core, 32/64-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 105°C (TA) | 1.8V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M7 | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | - | USB 2.0 OTG (1) | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | 2.5Gbps (3) | 3 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1.3GHz | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | - | S32G3 | CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART |
关于 微处理器
微处理器是专门设计用于嵌入式系统的微处理器，这些系统是为在设备或机械中执行特定任务而定制的计算机系统。这些微处理器经过优化，以实现低功耗、实时处理和与其他组件无缝集成。它们的功能在于提供计算能力和控制能力，通常配备定制的外设、接口或指令集，以满足应用的特定要求。
它们在各个领域中都有应用，包括汽车电子（发动机控制单元、信息娱乐系统）、工业自动化（可编程逻辑控制器、机器人控制）、医疗设备（患者监测系统、可植入设备）、消费电子（智能手机、可穿戴设备）和家庭自动化。嵌入式微处理器支持这些行业的多样化计算需求，提供量身定制的性能和功能，推动现代嵌入式系统的运作。
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