选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Grade | Operating Temperature | Flash Size | RAM Size | Speed | Peripherals | Architecture | Connectivity | Package / Case | Supplier Device Package | Primary Attributes | Core Processor | Qualification | Series |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 2.3M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 573K Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | -40°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 573K Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | -40°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 573K Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | -40°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | -40°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.9M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.9M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.9M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | -40°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 2.3M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | -40°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.9M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.9M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.9M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 2.3M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 2.3M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 2.3M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | -40°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 1.9M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | -40°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 2.3M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0°C ~ 100°C (TJ) | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | FPGA - 2.3M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex F |
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