RZ/T2M Series, 微处理器
结果:
12
Manufacturer
Series
Supplier Device Package
Package / Case
Security Features
Number of Cores/Bus Width
Core Processor
Display & Interface Controllers
Speed
Operating Temperature
USB
Grade
Mounting Type
Qualification
Additional Interfaces
Ethernet
RAM Controllers
Voltage - I/O
Graphics Acceleration
SATA
Co-Processors/DSP
结果：12
搜索条目:
RZ/T2M
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Mounting Type | Ethernet | USB | Operating Temperature | Voltage - I/O | Package / Case | Grade | Series | Core Processor | Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | Security Features | Supplier Device Package | Qualification | Additional Interfaces |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 128-LQFP Exposed Pad | - | RZ/T2M | ARM® Cortex®-R52 | 1 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | - | 128-LFQFP (14x20) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 176-LQFP Exposed Pad | - | RZ/T2M | ARM® Cortex®-R52 | 1 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | - | 176-LFQFP (24x24) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 128-LQFP Exposed Pad | - | RZ/T2M | ARM® Cortex®-R52 | 1 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | Boot Security, Crypto Accelerator, JTAG, TRNG | 128-LFQFP (14x20) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 176-LQFP Exposed Pad | - | RZ/T2M | ARM® Cortex®-R52 | 1 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | Boot Security, Crypto Accelerator, JTAG, TRNG | 176-LFQFP (24x24) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 225-LFBGA | - | RZ/T2M | ARM® Cortex®-R52 | 2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | Boot Security, Crypto Accelerator, JTAG, TRNG | 225-FBGA (13x13) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 225-LFBGA | - | RZ/T2M | ARM® Cortex®-R52 | 2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | - | 225-FBGA (13x13) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 225-LFBGA | - | RZ/T2M | ARM® Cortex®-R52 | 2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | - | 225-FBGA (13x13) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 225-LFBGA | - | RZ/T2M | ARM® Cortex®-R52 | 2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | Boot Security, Crypto Accelerator, JTAG, TRNG | 225-FBGA (13x13) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 225-LFBGA | - | RZ/T2M | ARM® Cortex®-R52 | 2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | Boot Security, Crypto Accelerator, JTAG, TRNG | 225-FBGA (13x13) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 320-LFBGA | - | RZ/T2M | ARM® Cortex®-R52 | 2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | - | 320-FBGA (17x17) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 320-LFBGA | - | RZ/T2M | ARM® Cortex®-R52 | 2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | Boot Security, Crypto Accelerator, JTAG, TRNG | 320-FBGA (17x17) | - | CANbus, I2C, SCI, SPI, WDT | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | USB 2.0 (1) | -40°C ~ 125°C (TJ) | 1.8V, 3.3V | 320-LFBGA | - | RZ/T2M | ARM® Cortex®-R52 | 2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | - | Boot Security, Crypto Accelerator, JTAG, TRNG | 320-FBGA (17x17) | - | CANbus, I2C, SCI, SPI, WDT |
关于 微处理器
微处理器是专门设计用于嵌入式系统的微处理器，这些系统是为在设备或机械中执行特定任务而定制的计算机系统。这些微处理器经过优化，以实现低功耗、实时处理和与其他组件无缝集成。它们的功能在于提供计算能力和控制能力，通常配备定制的外设、接口或指令集，以满足应用的特定要求。
它们在各个领域中都有应用，包括汽车电子（发动机控制单元、信息娱乐系统）、工业自动化（可编程逻辑控制器、机器人控制）、医疗设备（患者监测系统、可植入设备）、消费电子（智能手机、可穿戴设备）和家庭自动化。嵌入式微处理器支持这些行业的多样化计算需求，提供量身定制的性能和功能，推动现代嵌入式系统的运作。
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