RZ/G2E Series, 微处理器
结果:
10
Manufacturer
Series
Supplier Device Package
Package / Case
USB
Additional Interfaces
Number of Cores/Bus Width
Voltage - I/O
Display & Interface Controllers
Core Processor
Speed
Operating Temperature
Security Features
Ethernet
RAM Controllers
Graphics Acceleration
Co-Processors/DSP
Grade
Mounting Type
Qualification
SATA
结果：10
搜索条目:
RZ/G2E
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Mounting Type | Operating Temperature | Voltage - I/O | Package / Case | Grade | Core Processor | Speed | Series | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | Supplier Device Package | Qualification | Additional Interfaces |
|---|
 | 联系我们 | 282 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | - | 552-BGA | - | ARM® Cortex®-A53 | 1.2GHz | RZ/G2E | 2 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L | No | MIPI-CSI | 10/100Mbps (1), 100/1000Mbps (1) | - | USB 2.0 (1), USB 3.0 (1) | - | 552-FPBGA | - | CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | - | 552-FBGA | - | ARM® Cortex®-A53 | 1.2GHz | RZ/G2E | 2 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L | No | MIPI-CSI | 10/100Mbps (1), 100/1000Mbps (1) | - | USB 2.0 (1), USB 3.0 (1) | - | 552-FBGA (21x21) | - | CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 0.82V, 1.8V, 3.3V | 1022-BGA | - | ARM® Cortex®-A53, ARM® Cortex®-A57 | 1.2GHz, 1.5GHz | RZ/G2E | 8 Core, 64-Bit | - | LPDDR4 | No | DU | 10/100Mbps (1), 100/1000Mbps (1) | - | USB (4) | - | 1022-FPBGA | - | CAN, I2C, SCI, SPI | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C | 3.3V | 1022-BFBGA, FCBGA | - | ARM® Cortex®-A53, ARM® Cortex®-A57 | 1.2GHz, 1.5GHz | RZ/G2E | 4, 4 Core, 64-Bit | - | LPDDR4 | Yes | DU | 10/100Mbps (1) | - | USB 2.0 OTG (2), USB 3.0 (1) | - | 1022-FCBGA (29x29) | - | CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C | 3.3V | 1022-BFBGA, FCBGA | - | ARM® Cortex®-A53, ARM® Cortex®-A57 | 1.2GHz, 1.5GHz | RZ/G2E | 4, 4 Core, 64-Bit | - | LPDDR4 | Yes | DU | 10/100Mbps (1) | - | USB 2.0 OTG (2), USB 3.0 (1) | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | 1022-FCBGA (29x29) | - | CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C | 3.3V | 1022-BFBGA, FCBGA | - | ARM® Cortex®-A53, ARM® Cortex®-A57 | 1.2GHz, 1.5GHz | RZ/G2E | 4, 4 Core, 64-Bit | - | LPDDR4 | Yes | DU | 10/100Mbps (1) | - | USB 2.0 OTG (2), USB 3.0 (1) | - | 1022-FCBGA (29x29) | - | CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C | 3.3V | 1022-BFBGA, FCBGA | - | ARM® Cortex®-A53, ARM® Cortex®-A57 | 1.2GHz, 1.5GHz | RZ/G2E | 4, 4 Core, 64-Bit | - | LPDDR4 | Yes | DU | 10/100Mbps (1) | - | USB 2.0 OTG (2), USB 3.0 (1) | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | 1022-FCBGA (29x29) | - | CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | - | 552-FBGA | - | ARM® Cortex®-A53 | 1.2GHz | RZ/G2E | 2 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L | No | MIPI-CSI | 10/100Mbps (1), 100/1000Mbps (1) | - | USB 2.0 (1), USB 3.0 (1) | - | 552-FBGA (21x21) | - | CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | - | 552-BGA | - | ARM® Cortex®-A53 | 1.2GHz | RZ/G2E | 2 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L | No | MIPI-CSI | 10/100Mbps (1), 100/1000Mbps (1) | - | USB 2.0 (1), USB 3.0 (1) | - | 552-FPBGA | - | CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 0.82V, 1.8V, 3.3V | 1022-BGA | - | ARM® Cortex®-A53, ARM® Cortex®-A57 | 1.2GHz, 1.5GHz | RZ/G2E | 8 Core, 64-Bit | - | LPDDR4 | No | DU | 10/100Mbps (1), 100/1000Mbps (1) | - | USB (4) | - | 1022-FPBGA | - | CAN, I2C, SCI, SPI |
关于 微处理器
微处理器是专门设计用于嵌入式系统的微处理器，这些系统是为在设备或机械中执行特定任务而定制的计算机系统。这些微处理器经过优化，以实现低功耗、实时处理和与其他组件无缝集成。它们的功能在于提供计算能力和控制能力，通常配备定制的外设、接口或指令集，以满足应用的特定要求。
它们在各个领域中都有应用，包括汽车电子（发动机控制单元、信息娱乐系统）、工业自动化（可编程逻辑控制器、机器人控制）、医疗设备（患者监测系统、可植入设备）、消费电子（智能手机、可穿戴设备）和家庭自动化。嵌入式微处理器支持这些行业的多样化计算需求，提供量身定制的性能和功能，推动现代嵌入式系统的运作。
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