微控制器、微处理器、FPGA 模块
结果:
1,715
Manufacturer
Series
Core Processor
Size / Dimension
Connector Type
Speed
Flash Size
Co-Processor
RAM Size
Operating Temperature
Module/Board Type
Watchdog Timer
Digital I/O Lines
Supplier Device Package
Form Factor
Function
Cooling Type
Package / Case
Storage Interface
Voltage - Supply
Expansion Site/Bus
Video Outputs
USB
Grade
Current - Supply
Mounting Type
RS-232 (422, 485)
RAM Capacity/Installed
Analog Input
Power (Watts)
Qualification
Contents
Ethernet
Number of Circuits
Number of Cores
Interface
结果：1,715
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Series | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | TE0741 | FPGA Core | Kintex-7 410T | - | 200MHz | 32MB | - | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | * | - | - | - | - | - | - | - | - | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0712 | FPGA Core | Artix-7 A35T | - | 200MHz | 32MB | 1GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0630 | FPGA, USB Core | Spartan-6 LX-150 | Cypress EZ-USB FX2LP | 100MHz | 8MB | 128MB | B2B | 1.600" L x 1.900" W (40.50mm x 47.50mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0630 | FPGA, USB Core | Spartan-6 LX-75 | Cypress EZ-USB FX2LP | 100MHz | 8MB | 128MB | B2B | 1.600" L x 1.900" W (40.50mm x 47.50mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0729 | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7020) | - | 32MB | 512MB | Samtec BTE | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | MitySOM | MPU Core | ARM® Cortex®-A8, AM3354 | NEON™ SIMD | 800MHz | - | 256MB | SO-DIMM-204 | 2.660" L x 1.500" W (67.60mm x 38.10mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0712 | FPGA Core | Artix-7 A200T | - | 200MHz | 32MB | 1GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | TE0723 | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7010) | 12MHz | 16MB | 512MB | B2B | - | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0600 | FPGA Core | Spartan-6 LX-150 | - | 125MHz | 16MB | 1GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | - | FPGA Core | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0741 | FPGA Core | Kintex-7 325T | - | 200MHz | 32MB | - | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0741 | FPGA Core | Kintex-7 160T | - | 200MHz | 32MB | - | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0745 | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ||
| MOD H264 EN 60FPS 4K SX660 SODIM | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | H.264-HD Encoder | FPGA Core | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 1.5GHz | 128KB | 512MB | - | - | |
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | TE0808 | MPU Core | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | TE0841 | MCU, FPGA | Kintex UltraScale KU40 | - | - | 64MB | 2GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0745 | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | TE0803 | MPU Core | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | TE0808 | MPU Core | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 2GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) |
关于 微控制器、微处理器、FPGA 模块
模块化嵌入式处理器系列产品由微控制器、微处理器、数字信号处理器、FPGA或其他计算设备与支持组件（如存储器、电源管理和定时器）相结合而成。这些产品旨在集成到最终产品中，使产品开发人员能够获得先进的计算和接口能力，而无需高速硬件设计专业知识。
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