微控制器、微处理器、FPGA 模块
结果:
1,711
Manufacturer
Series
Core Processor
Size / Dimension
Connector Type
Speed
Flash Size
Co-Processor
RAM Size
Operating Temperature
Module/Board Type
Watchdog Timer
Digital I/O Lines
Supplier Device Package
Form Factor
Function
Cooling Type
Package / Case
Storage Interface
Voltage - Supply
Expansion Site/Bus
Video Outputs
USB
Grade
Current - Supply
Mounting Type
RS-232 (422, 485)
RAM Capacity/Installed
Analog Input
Power (Watts)
Qualification
Contents
Ethernet
Number of Circuits
Number of Cores
Interface
结果：1,711
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Speed | Series | Module/Board Type | Flash Size | RAM Size | Connector Type | Size / Dimension | Co-Processor | Core Processor |
|---|
 | 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0711 | MPU Core | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ARM Cortex-A9 | Zynq™ 7015 XC7Z015-2CLG485I | ||
| 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | - | Ethernet Core | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ARM® Cortex®-A9 | ||
 | 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | -40°C ~ 80°C | 75MHz | Digi Connect ME® | MPU Core | 4MB | 8MB | RJ45 | 1.450" L x 0.750" W (36.70mm x 19.10mm) | - | ARM926EJ-S, NS9210 | ||
 | 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | 58.98MHz | RabbitCore RCM4100 | MPU Core | 512KB | 1MB | IDC Header 2x25, 2x5 | 1.410" L x 1.880" W (36.00mm x 48.00mm) | - | Rabbit 4000 | ||
 | 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | 1GHz | OSD335x | MPU Core | - | 1GB | 256-BGA | 0.830" L x 0.830" W (21.00mm x 21.00mm) | - | ARM® Cortex®-A8, AM3358 | ||
| 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | -40°C ~ 80°C | 75MHz | Digi Connect ME® | MPU Core | 2MB | 8MB | RJ45 | 1.450" L x 0.750" W (36.70mm x 19.10mm) | - | ARM926EJ-S, NS9210 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 456MHz | MitySOM | MPU Core | 256MB (NAND), 8MB (NOR) | 8KB (Internal), 128MB (External) | SO-DIMM-200 | 2.660" L x 1.500" W (67.60mm x 38.10mm) | - | ARM926EJ-S, AM1808 | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | * | - | - | - | - | - | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 600MHz | Blackfin® | MPU Core | 4MB | 32MB | Expansion 2 x 60 | 1.440" L x 1.240" W (36.50mm x 31.50mm) | - | CM-BF537 | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 456MHz | MityDSP-L138 | MPU, DSP, FPGA Core | 256MB (NAND), 16MB (NOR) | 128MB | SO-DIMM-200 | 2.660" L x 2.000" W (67.60mm x 50.80mm) | TMS320C674x (DSP) | ARM926EJ-S, OMAP-L138 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 44.2MHz | RabbitCore RCM3220 | MPU Core | 512KB | 768KB | 2 IDC Headers 2x17 | 1.850" L x 2.730" W (47.00mm x 69.00mm) | - | Rabbit 3000 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | 1.2GHz | MitySOM | MPU, FPGA Core | - | 4GB | Board-to-Board (BTB) | 4.000" L x 4.000" W (101.50mm x 101.50mm) | NEON™ SIMD | ARM® Cortex®-A9 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 1.5GHz | - | MPU, FPGA Core | 32MB | 1GB | Edge Connector - 310, Board-to-Board (BTB) - 100 | 3.460" L x 2.730" W (87.88mm x 69.34mm) | Artix-7 | ARM Cortex-A15 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | 300MHz | - | MCU, Ethernet Core | 2MB | 8MB | 10-Pin Header | 2.600" L x 2.000" W (66.04mm x 50.80mm) | - | ARM® Cortex®-M7 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 4MHz | BASIC Stamp® | MCU Core | 256B EEPROM | 16B | - | 1.400" L x 0.600" W (35.60mm x 15.20mm) | - | PIC16C56A | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | 50MHz | - | MPU Core | 1GB (NAND) | 1.024GB | 200 Pin | 2.660" L x 1.180" W (67.60mm x 30.00mm) | Zynq-7000 (Z-7020) | ARM Cortex-A9 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | - | MCU, FPGA | 64MB | 512MB | 200 Pin | 2.660" L x 1.180" W (67.60mm x 30.00mm) | Zynq-7000 (Z-7010) | ARM Cortex-A9 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 20MHz | BASIC Stamp® | MCU Core | 16KB EEPROM | 38B | - | 1.200" L x 0.600" W (30.00mm x 15.00mm) | - | SX48AC | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 1.5GHz, 750MHz | i.MX 8M Nano | MPU Core | 8GB | 1GB | 3 x 100 Pins HD Connectors | 1.100" L x 1.500" W (28.00mm x 38.00mm) | - | ARM® Cortex®-A53, ARM® Cortex™-M7 | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | 48MHz | eZ80® Acclaim!® | MCU Core | 8MB | 512KB | Header 2x25 | - | - | eZ80L92 |
微控制器、微处理器、FPGA 模块
模块化嵌入式处理器系列产品由微控制器、微处理器、数字信号处理器、FPGA或其他计算设备与支持组件（如存储器、电源管理和定时器）相结合而成。这些产品旨在集成到最终产品中，使产品开发人员能够获得先进的计算和接口能力，而无需高速硬件设计专业知识。
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