TE0823 Series, 微控制器、微处理器、FPGA 模块
结果:
11
Manufacturer
Series
Core Processor
RAM Size
Co-Processor
Connector Type
Module/Board Type
Operating Temperature
Flash Size
Speed
Size / Dimension
结果：11
搜索条目:
TE0823
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Speed | Series | Module/Board Type | Core Processor | Co-Processor | Flash Size | RAM Size | Connector Type | Size / Dimension |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0823 | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | - | - | - | USB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0823 | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | 128MB | 1GB | USB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0823 | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | 128MB | 1GB | USB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0823 | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | - | - | - | USB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0823 | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | 128MB | 1GB | USB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0823 | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | 128MB | 1GB | USB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0823 | MPU Core | Zynq UltraScale+ XCZU2CG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 4GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0823 | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0823 | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0823 | MPU Core | Zynq UltraScale+ XCZU3CG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 4GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0823 | MPU Core | Zynq™ UltraScale+™ XCZU3EG-1SFVC784I | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 2GB | 2 x 160 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) |
关于 微控制器、微处理器、FPGA 模块
模块化嵌入式处理器系列产品由微控制器、微处理器、数字信号处理器、FPGA或其他计算设备与支持组件（如存储器、电源管理和定时器）相结合而成。这些产品旨在集成到最终产品中，使产品开发人员能够获得先进的计算和接口能力，而无需高速硬件设计专业知识。
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