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| | CONN IC DIP SOCKET ZIF 64POS GLD | | | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | Connector | 64 (2 x 32) | Press-Fit | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | 3M TEXTOOL ZIP STRIP SOCKETS 255 | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polyethersulfone (PES) | -55°C ~ 150°C | Through Hole | 145 (15 x 15) | Solder | PGA, ZIF (ZIP) | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polyethersulfone (PES) | -55°C ~ 150°C | Through Hole | 141 (21 x 21) | Solder | PGA, ZIF (ZIP) | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polyethersulfone (PES) | -55°C ~ 150°C | Through Hole | 225 (15 x 15) | Solder | PGA, ZIF (ZIP) | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polyethersulfone (PES) | -55°C ~ 150°C | Through Hole | 108 (13 x 13) | Solder | PGA, ZIF (ZIP) | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | TEXTOOL 268-6311-9UA-1902 PGA 11 | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
| | TEXTOOL 2196-9110-02-1101 BGA/LG | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
| | TEXTOOL 2196-9026-01-2401 BGA OP | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
| | 3M TEXTOOL ZIP STRIP SOCKETS 255 | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
| | TEXTOOL 0.65 MM PITCH OPEN TOP B | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
| | CONN IC DIP SOCKET ZIF 14POS GLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | Connector | 14 (2 x 7) | Press-Fit | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | 3M TEXTOOL TEST & BURN-IN SPGA S | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
| | CONN SOCKET PGA ZIF 121POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polyethersulfone (PES) | -55°C ~ 150°C | Through Hole | 121 (11 x 11) | Solder | PGA, ZIF (ZIP) | 30.0µin (0.76µm) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper |
| | TEXTOOLBURN-IN GRID ZIP SOCKETS | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polyethersulfone (PES) | -55°C ~ 150°C | Through Hole | 132 (13 x 13) | Solder | PGA, ZIF (ZIP) | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | CONN IC DIP SOCKET ZIF 24POS GLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | Connector | 24 (2 x 12) | Press-Fit | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | CONN IC DIP SOCKET ZIF 28POS GLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | Connector | 28 (2 x 14) | Press-Fit | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |
| | CONN SOCKET QFN 64POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.020" (0.50mm) | Gold | 0.020" (0.50mm) | Gold | Polyethersulfone (PES) | - | Through Hole | 64 (4 x 16) | Solder | QFN | - | Beryllium Copper | Open Frame | - | Beryllium Copper |
| | CONN SOCKET SIP ZIF 24POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | 0.100" (2.54mm) | Gold | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | Through Hole | 24 (1 x 24) | Solder | SIP, ZIF (ZIP) | - | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper |
| | CONN SOCKET SOIC 8POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | Textool™ | - | Gold | - | Gold | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C | Through Hole | 8 (2 x 4) | Solder | SOIC | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper |