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| | CONN IC DIP SOCKET 16POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 16 (2 x 8) | Polyester, Glass Filled | IC | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Phosphor Bronze |
| | CONN IC DIP SOCKET 16POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 16 (2 x 8) | Polyester, Glass Filled | IC | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 10.0µin (0.25µm) | Phosphor Bronze |
| | CONN IC DIP SOCKET 28POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 28 (2 x 14) | Polyester, Glass Filled | IC | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Phosphor Bronze |
| | CONN IC DIP SOCKET 28POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 28 (2 x 14) | Polyester, Glass Filled | IC | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 10.0µin (0.25µm) | Phosphor Bronze |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.020" (0.50mm) | Gold | Through Hole | Solder | 0.020" (0.50mm) | - | -40°C ~ 170°C | 144 | Polyphenylene Sulfide (PPS), Glass Filled | IC | QFP | - | Beryllium Copper | Closed Frame | - | - |