选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Number of Positions or Pins (Grid) | Housing Material | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 32 (1 x 32) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 150.0µin (3.81µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 20 (1 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 20 (1 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 20 (1 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 27 (1 x 27) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 8 (1 x 8) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 150.0µin (3.81µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 13 (1 x 13) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 21 (1 x 21) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 15 (1 x 15) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 150.0µin (3.81µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 14 (1 x 14) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 6 (1 x 6) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 150.0µin (3.81µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 4 (1 x 4) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 150.0µin (3.81µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 4 (1 x 4) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 6 (1 x 6) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 5 (1 x 5) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 7 (1 x 7) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 6 (1 x 6) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 7 (1 x 7) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 150.0µin (3.81µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 8 (1 x 8) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 5 (1 x 5) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 150.0µin (3.81µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass |
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