选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Features | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Housing Material | Operating Temperature | Number of Positions or Pins (Grid) | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 200.0µin (5.08µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | - | PGM | PGA | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass |
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