选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Housing Material | Number of Positions or Pins (Grid) | Operating Temperature | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 16 (2 x 8) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Surface Mount | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 28 (2 x 14) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Surface Mount | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 24 (2 x 12) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Surface Mount | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 16 (2 x 8) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 28 (2 x 14) | -55°C ~ 125°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Surface Mount | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 14 (2 x 7) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Surface Mount | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 14 (2 x 7) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 24 (2 x 12) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 24 (2 x 12) | -55°C ~ 125°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 28 (2 x 14) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 28 (2 x 14) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 24 (2 x 12) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 24 (2 x 12) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 16 (2 x 8) | -55°C ~ 125°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 14 (2 x 7) | -55°C ~ 125°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 16 (2 x 8) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 16 (2 x 8) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 14 (2 x 7) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 14 (2 x 7) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 14 (2 x 7) | -55°C ~ 105°C | EJECT-A-DIP™ | DIP, 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass |
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