| | | | | | | | | | | | | | | | | | | | | |
| | CONN IC DIP SOCKET 16POS TINLEAD | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin-Lead | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | 16 (2 x 8) | DPF3 | DIP, 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| | CONN IC DIP SOCKET 14POS TINLEAD | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin-Lead | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | 14 (2 x 7) | DPF3 | DIP, 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| | CONN IC DIP SOCKET 8POS TIN-LEAD | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin-Lead | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | 8 (2 x 4) | DPF3 | DIP, 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |