Diplomate DL 系列, IC插座

结果:
202
Manufacturer
Series
Number of Positions or Pins (Grid)
Housing Material
Operating Temperature
Contact Material - Post
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Features
Contact Finish - Mating
Type
Contact Finish - Post
Mounting Type
Contact Material - Mating
Termination
Pitch - Post
Pitch - Mating
结果202
搜索条目:
Diplomate DL
选择
图片产品详情单价可用性ECAD 模型Pitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialOperating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
1-382568-6
CONN IC DIP SOCKET 16POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643648-8
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
2-641614-4
CONN IC DIP SOCKET 24POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
24 (2 x 12)
-
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Open Frame
15.0µin (0.38µm)
Phosphor Bronze
2-382189-2
CONN IC DIP SOCKET 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
32 (2 x 16)
Thermoplastic
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
-
Beryllium Copper
2-641599-4
CONN IC DIP SOCKET 14POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
14 (2 x 7)
Thermoplastic, Glass Filled
-55°C ~ 125°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Open Frame
15.0µin (0.38µm)
Phosphor Bronze
2-382568-5
CONN IC DIP SOCKET 24POS TIN
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643643-6
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
11 (1 x 11)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
2-641604-4
CONN IC DIP SOCKET 24POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
24 (2 x 12)
Thermoplastic, Glass Filled
-55°C ~ 125°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Open Frame
15.0µin (0.38µm)
Phosphor Bronze
2-643649-3
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
17 (1 x 17)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
1825374-4
CONN IC DIP SOCKET 16POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
16 (2 x 8)
Thermoplastic, Glass Filled
-55°C ~ 125°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Open Frame
15.0µin (0.38µm)
Phosphor Bronze
641855-1
CONN IC DIP SOCKET 24POS TIN
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Thermoplastic
-55°C ~ 125°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Beryllium Copper
643662-3
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
30 (1 x 30)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
1825109-1
CONN IC DIP SOCKET 24POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
24 (2 x 12)
Thermoplastic, Glass Filled
-55°C ~ 125°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Open Frame
15.0µin (0.38µm)
Phosphor Bronze
1825374-6
CONN IC DIP SOCKET 20POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
20 (2 x 10)
Thermoplastic, Glass Filled
-55°C ~ 125°C
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Open Frame
15.0µin (0.38µm)
Phosphor Bronze
643640-8
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
8 (1 x 8)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
641856-1
CONN IC DIP SOCKET 28POS TIN
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Beryllium Copper
643647-8
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
15 (1 x 15)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643651-3
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
19 (1 x 19)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643649-8
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
17 (1 x 17)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643640-6
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
8 (1 x 8)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。