选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Number of Positions or Pins (Grid) | Housing Material | Operating Temperature | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 16 (2 x 8) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 16 (1 x 16) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 24 (2 x 12) | - | - | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | 15.0µin (0.38µm) | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | 32 (2 x 16) | Thermoplastic | - | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 14 (2 x 7) | Thermoplastic, Glass Filled | -55°C ~ 125°C | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | 15.0µin (0.38µm) | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 24 (2 x 12) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 11 (1 x 11) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 24 (2 x 12) | Thermoplastic, Glass Filled | -55°C ~ 125°C | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | 15.0µin (0.38µm) | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 17 (1 x 17) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 16 (2 x 8) | Thermoplastic, Glass Filled | -55°C ~ 125°C | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | 15.0µin (0.38µm) | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 24 (2 x 12) | Thermoplastic | -55°C ~ 125°C | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | - | Beryllium Copper | Open Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 30 (1 x 30) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 24 (2 x 12) | Thermoplastic, Glass Filled | -55°C ~ 125°C | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | 15.0µin (0.38µm) | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 20 (2 x 10) | Thermoplastic, Glass Filled | -55°C ~ 125°C | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | 15.0µin (0.38µm) | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 8 (1 x 8) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 28 (2 x 14) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | - | Beryllium Copper | Open Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 15 (1 x 15) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 19 (1 x 19) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 17 (1 x 17) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 8 (1 x 8) | Thermoplastic, Glass Filled | -55°C ~ 105°C | Diplomate DL | SIP | - | Beryllium Copper | Closed Frame | - | Beryllium Copper |
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