选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Number of Positions or Pins (Grid) | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post | Housing Material |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 6 (2 x 3) | D95 | DIP, 0.3" (7.62mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 16 (2 x 8) | D95 | DIP, 0.3" (7.62mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 18 (2 x 9) | D95 | DIP, 0.3" (7.62mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 20 (2 x 10) | D95 | DIP, 0.3" (7.62mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 22 (2 x 11) | D95 | DIP, 0.3" (7.62mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 24 (2 x 12) | D95 | DIP, 0.4" (10.16mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 28 (2 x 14) | D95 | DIP, 0.6" (15.24mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 32 (2 x 16) | D95 | DIP, 0.6" (15.24mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 22 (2 x 11) | D95 | DIP, 0.4" (10.16mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 24 (2 x 12) | D95 | DIP, 0.6" (15.24mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 48 (2 x 24) | D95 | DIP, 0.6" (15.24mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 24 (2 x 12) | D95 | DIP, 0.6" (15.24mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 8 (2 x 4) | D95 | DIP, 0.3" (7.62mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 14 (2 x 7) | D95 | DIP, 0.3" (7.62mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 42 (2 x 21) | D95 | DIP, 0.6" (15.24mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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