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| | CONN IC DIP SOCKET 14POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 14 (2 x 7) | Press-Fit | D26 | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| | CONN IC DIP SOCKET 16POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 16 (2 x 8) | Press-Fit | D26 | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| | CONN IC DIP SOCKET 20POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 20 (2 x 10) | Press-Fit | D26 | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| | CONN IC DIP SOCKET 24POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 24 (2 x 12) | Press-Fit | D26 | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| | CONN IC DIP SOCKET 28POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 28 (2 x 14) | Press-Fit | D26 | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| | CONN IC DIP SOCKET 32POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 32 (2 x 16) | Press-Fit | D26 | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| | CONN IC DIP SOCKET 40POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 40 (2 x 20) | Press-Fit | D26 | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 18 (2 x 9) | Press-Fit | D26 | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| | CONN IC DIP SOCKET 8POS GOLD | | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 8 (2 x 4) | Press-Fit | D26 | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |