BU-178HT 系列, IC插座

结果:
12
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Features
Contact Material - Mating
Pitch - Mating
结果12
搜索条目:
BU-178HT
选择
图片产品详情单价可用性ECAD 模型Mounting TypePitch - MatingContact Finish - MatingTerminationPitch - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish - PostContact Finish Thickness - PostContact Material - Post
BU160Z-178-HT
CONN IC DIP SOCKET 16POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU180Z-178-HT
CONN IC DIP SOCKET 18POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
18 (2 x 9)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU200Z-178-HT
CONN IC DIP SOCKET 20POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
20 (2 x 10)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU060Z-178-HT
CONN IC DIP SOCKET 6POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
6 (2 x 3)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU240Z-178-HT
CONN IC DIP SOCKET 24POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.6" (15.24mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU400Z-178-HT
CONN IC DIP SOCKET 40POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
40 (2 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.6" (15.24mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU640Z-178-HT
CONN IC DIP SOCKET 64POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
64 (2 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.9" (22.86mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU480Z-178-HT
CONN IC DIP SOCKET 48POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
48 (2 x 24)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.6" (15.24mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU280Z-178-HT
CONN IC DIP SOCKET 28POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.6" (15.24mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU220Z-178-HT
CONN IC DIP SOCKET 22POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
22 (2 x 11)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.4" (10.16mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU14OZ-178-HT
CONN IC DIP SOCKET 14POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
14 (2 x 7)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass
BU080Z-178-HT
CONN IC DIP SOCKET 8POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-55°C ~ 125°C
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
78.7µin (2.00µm)
Beryllium Copper
Open Frame
Copper
Flash
Brass

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。