选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Housing Material | Number of Positions or Pins (Grid) | Operating Temperature | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10 (2 x 5) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 20 (2 x 10) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 20 (2 x 10) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 14 (2 x 7) | -55°C ~ 105°C | 8 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 12 (2 x 6) | -55°C ~ 105°C | 8 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 12 (2 x 6) | -55°C ~ 105°C | 8 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 12 (2 x 6) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 12 (2 x 6) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10 (2 x 5) | -55°C ~ 105°C | 8 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10 (2 x 5) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 14 (2 x 7) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame, Elevated | 200.0µin (5.08µm) | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10 (2 x 5) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10 (2 x 5) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10 (2 x 5) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 8 (2 x 4) | -55°C ~ 105°C | 8 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 8 (2 x 4) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 6 (2 x 3) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 6 (2 x 3) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 6 (2 x 3) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | 10.0µin (0.25µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 16 (2 x 8) | -55°C ~ 105°C | 8 | DIP, 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame, Elevated | 200.0µin (5.08µm) | Phosphor Bronze |
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