选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Number of Positions or Pins (Grid) | Housing Material | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
---|
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 40 (2 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Nickel Boron | Through Hole | Solder | 0.100" (2.54mm) | Nickel Boron | 40 (2 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | 50.0µin (1.27µm) | Beryllium Nickel | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Nickel Boron | Through Hole | Solder | 0.100" (2.54mm) | Nickel Boron | 40 (2 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | 50.0µin (1.27µm) | Beryllium Nickel | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Nickel Boron | Through Hole | Solder | 0.100" (2.54mm) | Nickel Boron | 40 (2 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | 50.0µin (1.27µm) | Beryllium Nickel | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Nickel Boron | Through Hole | Solder | 0.100" (2.54mm) | Nickel Boron | 40 (2 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | 50.0µin (1.27µm) | Beryllium Nickel | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Nickel Boron | Through Hole | Solder | 0.100" (2.54mm) | Nickel Boron | 40 (2 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | 50.0µin (1.27µm) | Beryllium Nickel | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 40 (2 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Nickel Boron | Through Hole | Solder | 0.100" (2.54mm) | Nickel Boron | 40 (2 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | 57 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | 50.0µin (1.27µm) | Beryllium Nickel |
告诉我们您在找什么?