518 系列, IC插座

结果:
627
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Contact Finish - Post
Housing Material
Features
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Mounting Type
Pitch - Post
Pitch - Mating
Termination
Contact Material - Mating
结果627
搜索条目:
518
选择
图片产品详情单价可用性ECAD 模型Operating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)SeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
60-1518-10
CONN IC DIP SOCKET 60POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
60 (2 x 30)
518
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
40-6518-101T
CONN IC DIP SOCKET 40POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
40 (2 x 20)
518
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
518-77-256M20-001106
CONN SOCKET PGA 256POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
256 (20 x 20)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-255M16-001105
CONN SOCKET PGA 255POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
255 (16 x 16)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-256M16-000105
CONN SOCKET PGA 256POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
256 (16 x 16)
518
PGA
Flash
Beryllium Copper
Closed Frame
Flash
Brass
518-77-256M20-001105
CONN SOCKET PGA 256POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
256 (20 x 20)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-255M16-001106
CONN SOCKET PGA 255POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
255 (16 x 16)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-256M16-000106
CONN SOCKET PGA 256POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
256 (16 x 16)
518
PGA
Flash
Beryllium Copper
Closed Frame
Flash
Brass
518-77-520M31-001106
CONN SOCKET PGA 520POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
520 (31 x 31)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
50-9518-11H
CONN IC DIP SOCKET 50POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
50 (2 x 25)
518
DIP, 0.9" (22.86mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Brass
518-77-576M30-001105
CONN SOCKET PGA 576POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
576 (30 x 30)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-560M33-001106
CONN SOCKET PGA 560POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
560 (33 x 33)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-576M30-001106
CONN SOCKET PGA 576POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
576 (30 x 30)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-600M35-001105
CONN SOCKET PGA 600POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
600 (35 x 35)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-600M35-001106
CONN SOCKET PGA 600POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
600 (35 x 35)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-652M35-001106
CONN SOCKET PGA 652POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
652 (35 x 35)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-652M35-001105
CONN SOCKET PGA 652POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
652 (35 x 35)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-456M26-001106
CONN SOCKET PGA 456POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
456 (26 x 26)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-478M26-131105
CONN SOCKET PGA 478POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
478 (26 x 26)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass
518-77-478M26-131106
CONN SOCKET PGA 478POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
FR4 Epoxy Glass
478 (26 x 26)
518
PGA
Flash
Beryllium Copper
Open Frame
Flash
Brass

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。