选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Series | Type | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post | Housing Material |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 256 (16 x 16) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 520 (31 x 31) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 480 (29 x 29) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 478 (26 x 26) | 10.0µin (0.25µm) | Brass | Open Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 576 (30 x 30) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 272 (20 x 20) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 256 (16 x 16) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 256 (20 x 20) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 255 (16 x 16) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 256 (20 x 20) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 192 (16 x 16) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 255 (16 x 16) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 432 (31 x 31) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 400 (20 x 20) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 400 (20 x 20) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 388 (26 x 26) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | BGA | 357 (19 x 19) | 10.0µin (0.25µm) | Brass | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 356 (26 x 26) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 352 (26 x 26) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 558 | PGA | 357 (19 x 19) | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
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