选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Number of Positions or Pins (Grid) | Series | Housing Material | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 44 (2 x 22) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 32 (2 x 16) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 28 (2 x 14) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 28 (2 x 14) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 28 (2 x 14) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 24 (2 x 12) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 32 (2 x 16) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 48 (2 x 24) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 44 (2 x 22) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 42 (2 x 21) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 44 (2 x 22) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 44 (2 x 22) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 44 (2 x 22) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 44 (2 x 22) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -55°C ~ 250°C | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 28 (2 x 14) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Nickel Boron | Through Hole | Solder | 0.100" (2.54mm) | Nickel Boron | 28 (2 x 14) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 50.0µin (1.27µm) | Beryllium Copper | Closed Frame | 50.0µin (1.27µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | 28 (2 x 14) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 42 (2 x 21) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 42 (2 x 21) | 55 | Polyphenylene Sulfide (PPS), Glass Filled | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Beryllium Copper |
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