800 系列, IC插座

结果:
164
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Type
Housing Material
Contact Finish - Mating
Contact Material - Post
Contact Finish - Post
Operating Temperature
Mounting Type
Contact Material - Mating
Termination
Pitch - Post
Features
Pitch - Mating
结果164
搜索条目:
800
选择
图片产品详情单价可用性ECAD 模型Pitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostSeriesNumber of Positions or Pins (Grid)Operating TemperatureTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
808-AG11D-ESL-LF
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4,008 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
800
8 (2 x 4)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
6-1437539-3
CONN IC DIP SOCKET 22POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
800
22 (2 x 11)
-55°C ~ 105°C
DIP, 0.4" (10.16mm) Row Spacing
5.00µin (0.127µm)
Copper Alloy
Open Frame
-
-
Polyester
1437538-2
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
800
28 (2 x 14)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
-
Copper Alloy
Open Frame
-
-
Polyester
3-1437537-0
CONN IC DIP SOCKET 14POS TINLEAD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Surface Mount
Solder
0.100" (2.54mm)
-
800
14 (2 x 7)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
-
Copper Alloy
Open Frame
-
-
Polyester
1571552-5
CONN IC DIP SOCKET 18POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
800
18 (2 x 9)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
7-1437537-6
CONN IC DIP SOCKET 20POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
800
20 (2 x 10)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
25.0µin (0.63µm)
Copper Alloy
Open Frame
-
-
Polyester
1-1437537-7
CONN IC DIP SOCKET 8POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
800
8 (2 x 4)
-
DIP, 0.3" (7.62mm) Row Spacing
25.0µin (0.63µm)
Copper Alloy
Open Frame
-
-
-
1-1437540-2
CONN IC DIP SOCKET 36POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
-
800
36 (2 x 18)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
-
Copper Alloy
Open Frame
-
-
Polyester
2-1437540-2
CONN IC DIP SOCKET 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
800
32 (2 x 16)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
5.00µin (0.127µm)
Copper Alloy
Open Frame
-
-
Polyester
4-1437538-4
CONN IC DIP SOCKET 48POS TINLEAD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
-
800
48 (2 x 24)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
-
Copper Alloy
Open Frame
-
-
Polyester
4-1437539-8
CONN IC DIP SOCKET 18POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
800
18 (2 x 9)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
5.00µin (0.127µm)
Copper Alloy
Open Frame
-
-
Polyester
5-1437539-8
CONN IC DIP SOCKET 20POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
-
800
20 (2 x 10)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
-
Copper Alloy
Open Frame
-
-
Polyester
9-1437539-4
CONN IC DIP SOCKET 28POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
800
28 (2 x 14)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
80.0µin (2.03µm)
Copper Alloy
Open Frame
-
-
Polyester
3-1571552-5
CONN IC DIP SOCKET 64POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
800
64 (2 x 32)
-55°C ~ 105°C
DIP, 0.9" (22.86mm) Row Spacing
Flash
Beryllium Copper
Open Frame
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
5-1571552-5
CONN IC DIP SOCKET 64POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
800
64 (2 x 32)
-55°C ~ 105°C
DIP, 0.9" (22.86mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Open Frame
20.0µin (0.51µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571586-6
CONN IC DIP SOCKET 20POS TIN
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
800
20 (2 x 10)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571586-7
CONN IC DIP SOCKET 22POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
800
22 (2 x 11)
-55°C ~ 105°C
DIP, 0.4" (10.16mm) Row Spacing
25.0µin (0.63µm)
Beryllium Copper
Open Frame
25.0µin (0.63µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1825046-9
CONN IC DIP SOCKET 28POS TIN
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Surface Mount
Solder
0.100" (2.54mm)
-
800
28 (2 x 14)
-
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Brass
-
5-1437537-4
CONN IC DIP SOCKET 16POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
800
16 (2 x 8)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
25.0µin (0.63µm)
Copper Alloy
Open Frame
-
-
Polyester
4-1437538-9
CONN IC DIP SOCKET 64POS TIN
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
-
800
64 (2 x 32)
-55°C ~ 105°C
DIP, 0.9" (22.86mm) Row Spacing
-
Copper Alloy
Open Frame
-
-
Polyester

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。