选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Number of Positions or Pins (Grid) | Housing Material | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
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![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 24 (2 x 12) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.6" (15.24mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Carrier | 29.5µin (0.75µm) | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | - | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 32 (1 x 32) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | SIP | - | Beryllium Copper | - | - | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 40 (2 x 20) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.6" (15.24mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Carrier | 29.5µin (0.75µm) | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 32 (1 x 32) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | SIP | 29.5µin (0.75µm) | Beryllium Copper | Carrier | 29.5µin (0.75µm) | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | - | - | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | 20 (1 x 20) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | Housing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | - | Through Hole | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | 32 (1 x 32) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | Housing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Threaded | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 26 (1 x 26) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | SIP | 10.0µin (0.25µm) | Beryllium Copper | - | 10.0µin (0.25µm) | Brass | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 20 (2 x 10) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 28 (2 x 14) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 10.0µin (0.25µm) | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15 (1 x 15) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 32 (1 x 32) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 16 (2 x 8) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | Zig-Zag | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 20 (1 x 20) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 10.0µin (0.25µm) | Beryllium Copper | ||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 8 (2 x 4) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.3" (7.62mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | 29.5µin (0.75µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 32 (2 x 16) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.6" (15.24mm) Row Spacing | 25.0µin (0.63µm) | Beryllium Copper | Open Frame | 25.0µin (0.63µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 24 (2 x 12) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 22 (2 x 11) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.4" (10.16mm) Row Spacing | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | 29.5µin (0.75µm) | Brass | |||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 20 (2 x 10) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.3" (7.62mm) Row Spacing | Flash | Beryllium Copper | Open Frame, Seal Tape | Flash | Beryllium Copper | ||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 32 (2 x 16) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 10.0µin (0.25µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 28 (2 x 14) | Polybutylene Terephthalate (PBT), Glass Filled | XR2 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Beryllium Copper |
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