XR2 系列, IC插座

结果:
51
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Contact Finish Thickness - Post
Type
Features
Mounting Type
Contact Finish - Mating
Contact Material - Post
Termination
Contact Finish - Post
Operating Temperature
Housing Material
Pitch - Post
Contact Material - Mating
Pitch - Mating
结果51
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XR2
选择
图片产品详情单价可用性ECAD 模型Pitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
XR2D-2401-N
CONN IC DIP SOCKET 24POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Carrier
29.5µin (0.75µm)
Beryllium Copper
XR2E-3205
CONN SOCKET SIP 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
-
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
-
Beryllium Copper
-
-
Beryllium Copper
XR2D-4001-N
CONN IC DIP SOCKET 40POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
40 (2 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Carrier
29.5µin (0.75µm)
Beryllium Copper
XR2E-3201-N
CONN SOCKET SIP 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
29.5µin (0.75µm)
Beryllium Copper
Carrier
29.5µin (0.75µm)
Beryllium Copper
XR2C-2000-HSG
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
-
-
Solder
0.100" (2.54mm)
-
-55°C ~ 125°C
20 (1 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
Housing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
XR2C-3200-HSG
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
-
Through Hole
Wire Wrap
0.100" (2.54mm)
-
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
Housing
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
XR2C2611N
CONN SOCKET SIP 26POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Threaded
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
26 (1 x 26)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
10.0µin (0.25µm)
Beryllium Copper
-
10.0µin (0.25µm)
Brass
XR2A-2001-N
CONN IC DIP SOCKET 20POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
20 (2 x 10)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Beryllium Copper
XR2A-2815
CONN IC DIP SOCKET 28POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Beryllium Copper
XR2C-1511-N
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
15 (1 x 15)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Beryllium Copper
XR2E-3204
CONN SOCKET SIP 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (1 x 32)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
XR2H-1611-N
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
16 (2 x 8)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
Zig-Zag
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Beryllium Copper
XR2C-2011-N
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
20 (1 x 20)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
10.0µin (0.25µm)
Beryllium Copper
XR2A-0802
CONN IC DIP SOCKET 8POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
-55°C ~ 125°C
8 (2 x 4)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.3" (7.62mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Open Frame
29.5µin (0.75µm)
Beryllium Copper
XR2A-3211-NZ
CONN IC DIP SOCKET 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (2 x 16)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
25.0µin (0.63µm)
Beryllium Copper
Open Frame
25.0µin (0.63µm)
Beryllium Copper
XR2A-2401-N
CONN IC DIP SOCKET 24POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
24 (2 x 12)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Beryllium Copper
XR2A2201N
CONN IC DIP SOCKET 22POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
22 (2 x 11)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.4" (10.16mm) Row Spacing
29.5µin (0.75µm)
Beryllium Copper
Open Frame
29.5µin (0.75µm)
Brass
XR2T-2021-N
CONN IC DIP SOCKET 20POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
20 (2 x 10)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame, Seal Tape
Flash
Beryllium Copper
XR2A-3211-N
CONN IC DIP SOCKET 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
32 (2 x 16)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Beryllium Copper
XR2A-2801-N
CONN IC DIP SOCKET 28POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
28 (2 x 14)
Polybutylene Terephthalate (PBT), Glass Filled
XR2
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
30.0µin (0.76µm)
Beryllium Copper

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。