Flex Stack, HMTMS Series, 针座，公插针
结果:
211
Manufacturer
Series
Number of Positions
Contact Length - Mating
Contact Length - Post
Overall Contact Length
Number of Positions Loaded
Contact Finish Thickness - Mating
Pitch - Mating
Contact Finish - Mating
Operating Temperature
Number of Rows
Row Spacing - Mating
Contact Finish - Post
Insulation Height
Ingress Protection
Voltage Rating
Current Rating (Amps)
Contact Type
Material Flammability Rating
Contact Material
Connector Type
Style
Features
Termination
Mounting Type
Fastening Type
Insulation Material
Contact Shape
Insulation Color
Shrouding
结果：211
搜索条目:
Flex Stack, HMTMS
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Features | Ingress Protection | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Contact Finish - Post | Material Flammability Rating | Operating Temperature | Contact Material | Number of Positions | Number of Rows | Insulation Color | Fastening Type | Style | Connector Type | Number of Positions Loaded | Contact Type | Contact Finish Thickness - Mating | Series | Row Spacing - Mating | Shrouding | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Insulation Material | Current Rating (Amps) | Voltage Rating |
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 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 20 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | - | - | 0.320" (8.13mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 1 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | 0.125" (3.18mm) | 0.105" (2.67mm) | 0.330" (8.38mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 1 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | 0.230" (5.84mm) | 0.225" (5.72mm) | 0.555" (14.10mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 32 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 30.0µin (0.76µm) | Flex Stack, HMTMS | - | Unshrouded | 0.285" (7.24mm) | 0.120" (3.05mm) | 0.505" (12.83mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 36 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | 0.075" (1.90mm) | 0.145" (3.68mm) | 0.320" (8.13mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 30 | 2 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 30.0µin (0.76µm) | Flex Stack, HMTMS | 0.100" (2.54mm) | Unshrouded | 0.140" (3.56mm) | 0.090" (2.29mm) | 0.330" (8.38mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 20 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 20 | 2 | Black | Push-Pull | Board to Board | Header | 19 | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | 0.100" (2.54mm) | Unshrouded | 0.125" (3.18mm) | 0.105" (2.67mm) | 0.330" (8.38mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 18 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 30.0µin (0.76µm) | Flex Stack, HMTMS | - | Unshrouded | 0.100" (2.54mm) | 0.120" (3.05mm) | 0.320" (8.13mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 18 | 2 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | 0.100" (2.54mm) | Unshrouded | 0.285" (7.24mm) | 0.120" (3.05mm) | 0.505" (12.83mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 2 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | 0.285" (7.24mm) | 0.120" (3.05mm) | 0.505" (12.83mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 20 | 2 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | 0.100" (2.54mm) | Unshrouded | 0.190" (4.83mm) | 0.120" (3.05mm) | 0.410" (10.41mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 14 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 30.0µin (0.76µm) | Flex Stack, HMTMS | - | Unshrouded | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 10 | 2 | Black | Push-Pull | Board to Board | Header | 9 | Male Pin | 30.0µin (0.76µm) | Flex Stack, HMTMS | 0.100" (2.54mm) | Unshrouded | 0.125" (3.18mm) | 0.105" (2.67mm) | 0.330" (8.38mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 16 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | 0.030" (0.76mm) | 0.190" (4.83mm) | 0.320" (8.13mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 10 | 2 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 30.0µin (0.76µm) | Flex Stack, HMTMS | 0.100" (2.54mm) | Unshrouded | 0.370" (9.40mm) | 0.140" (3.56mm) | 0.610" (15.50mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 12 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 30.0µin (0.76µm) | Flex Stack, HMTMS | - | Unshrouded | 0.100" (2.54mm) | 0.120" (3.05mm) | 0.320" (8.13mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 12 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | 0.110" (2.79mm) | 0.120" (3.05mm) | 0.330" (8.38mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Tin | - | -55°C ~ 125°C | Phosphor Bronze | 10 | 2 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 30.0µin (0.76µm) | Flex Stack, HMTMS | 0.100" (2.54mm) | Unshrouded | 0.125" (3.18mm) | 0.105" (2.67mm) | 0.330" (8.38mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0.050" (1.27mm) | Gold | Through Hole | Solder | Gold | - | -55°C ~ 125°C | Phosphor Bronze | 3 | 1 | Black | Push-Pull | Board to Board | Header | All | Male Pin | 10.0µin (0.25µm) | Flex Stack, HMTMS | - | Unshrouded | 0.125" (3.18mm) | 0.105" (2.67mm) | 0.330" (8.38mm) | 0.100" (2.54mm) | Square | Liquid Crystal Polymer (LCP) | - | - |
关于 针座，公插针
插头连接器是一种互连器，其特点是公引脚封装在塑料底座内，旨在与矩形电缆连接器或母插座插头配合以实现板对板连接。 这些连接器有多种位置和间距选项，其中一些具有分离式设计，可以轻松手动调整位置计数。 带罩接头连接器通常有 1 至 4 壁配置，可在触点之间提供额外的保护和绝缘。 一些连接器是无罩的，这可以为空间有限的应用提供更紧凑、更薄的设计。 插头连接器的安装选项包括面板安装、板边缘、堆叠、表面安装和通孔安装。 面板安装连接器设计用于安装在平坦表面上，而板边缘连接器设计用于插入 PCB 边缘。 堆叠连接器用于垂直堆叠多个 PCB，而表面安装连接器则使用焊接技术直接安装到 PCB 表面。 通孔连接器需要在 PCB 上钻孔才能插入。 总之，插头连接器提供了一种在板或电缆之间建立连接的可靠且高效的方法。 这些连接器有多种位置和间距选项，采用分离式设计，可轻松定制。 存在带罩和无罩选项，而安装选项包括面板安装、板边缘、堆叠、表面安装和通孔安装。 通过选择合适的连接器，设计人员可以确保其电子系统和设备的最佳性能、耐用性和效率。
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