LC3 Series, 薄膜电容器

结果:
18
Manufacturer
Series
Capacitance
ESR (Equivalent Series Resistance)
Voltage Rating - AC
Height - Seated (Max)
Size / Dimension
Operating Temperature
Dielectric Material
Applications
Tolerance
Termination
Lead Spacing
Mounting Type
Ratings
Voltage Rating - DC
Package / Case
Features
结果18
搜索条目:
LC3
选择
图片产品详情单价可用性ECAD 模型Mounting TypeVoltage Rating - DCFeaturesOperating TemperatureToleranceCapacitancePackage / CaseTerminationRatingsLead SpacingHeight - Seated (Max)Voltage Rating - ACSeriesDielectric MaterialESR (Equivalent Series Resistance)Size / DimensionApplications
104LC3102KL505HM6
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数量
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
0.1 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
1000V (1kV)
LC3
Polypropylene (PP)
1.2 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT
245LC3500KL505HM6
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数量
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
2.4 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
500V
LC3
Polypropylene (PP)
0.2 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT
245LC3500K5LM8
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
2.4 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
500V
LC3
Polypropylene (PP)
0.2 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
265LC3500K5LM8
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
2.6 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
500V
LC3
Polypropylene (PP)
0.2 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
505LC3400K5LM8
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数量
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PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
5 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
400V
LC3
Polypropylene (PP)
0.1 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
105LC3600K5LM8
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
1 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
600V
LC3
Polypropylene (PP)
0.5 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
125LC3600K5LM8
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
1.2 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
600V
LC3
Polypropylene (PP)
0.5 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
135LC3600K5LM8
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
1.32 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
600V
LC3
Polypropylene (PP)
0.3 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
254LC3700K5LM8
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
0.25 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
700V
LC3
Polypropylene (PP)
1.2 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
334LC3700K5LM8
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
0.33 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
700V
LC3
Polypropylene (PP)
1 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
664LC3700K5LM8
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
0.66 µF
Nonstandard
Solder Pads
-
-
1.358" (34.50mm)
700V
LC3
Polypropylene (PP)
0.8 mOhms
3.071" L x 3.071" W (78.00mm x 78.00mm)
Conduction Cooled; High Pulse, DV/DT
334LC3700KL505HM6
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
0.33 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
700V
LC3
Polypropylene (PP)
1 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT
664LC3700KL505HM6
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
0.66 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
700V
LC3
Polypropylene (PP)
0.8 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT
105LC3600KL505HM6
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
1 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
600V
LC3
Polypropylene (PP)
0.5 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT
125LC3600KL505HM6
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
1.2 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
600V
LC3
Polypropylene (PP)
0.5 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT
204LC3102KL505HM6
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
0.2 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
1000V (1kV)
LC3
Polypropylene (PP)
1.2 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT
254LC3700KL505HM6
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
0.25 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
700V
LC3
Polypropylene (PP)
1.2 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT
135LC3600KL505HM6
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Chassis Mount
-
-
-40°C ~ 85°C
±10%
1.32 µF
Nonstandard
Solder Pads
-
-
1.339" (34.00mm)
600V
LC3
Polypropylene (PP)
0.3 mOhms
1.969" L x 1.969" W (50.00mm x 50.00mm)
Conduction Cooled; High Pulse, DV/DT

关于  薄膜电容器

薄膜电容器是一种使用塑料薄膜材料作为其介电材料的电容器。它们是静电(非极化)电容器,与其他类型的电容器相比,具有普遍良好的参数稳定性和损耗特性。 薄膜电容器存在着各种结构和材料的变化,使其适应于各种用途。它们可用于小信号应用,通常替代陶瓷电容器的位置,也可用于功率应用,该领域通常使用电解电容器。 薄膜电容器在电子电路和系统中得到了广泛应用,包括音频设备、电视、计算机、工业控制系统和许多其他应用。由于其良好的特性和适应性,它们为电路设计师和工程师提供了灵活多样的选择。 总之,薄膜电容器是一种利用塑料薄膜材料作为介电材料的电容器。它们是静电电容器,与其他类型的电容器相比,具有普遍良好的参数稳定性和损耗特性。它们可适应各种用途,从小信号电子器件到高功率系统,并在电子电路和系统中的广泛应用发挥作用。