选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Mounting Type | Voltage Rating - DC | Features | Operating Temperature | Tolerance | Capacitance | Package / Case | Termination | Ratings | Lead Spacing | Height - Seated (Max) | Voltage Rating - AC | Series | Dielectric Material | ESR (Equivalent Series Resistance) | Size / Dimension | Applications |
---|
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 0.1 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 1000V (1kV) | LC3 | Polypropylene (PP) | 1.2 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 2.4 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 500V | LC3 | Polypropylene (PP) | 0.2 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 2.4 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 500V | LC3 | Polypropylene (PP) | 0.2 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 2.6 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 500V | LC3 | Polypropylene (PP) | 0.2 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 5 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 400V | LC3 | Polypropylene (PP) | 0.1 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 1 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 600V | LC3 | Polypropylene (PP) | 0.5 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 1.2 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 600V | LC3 | Polypropylene (PP) | 0.5 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 1.32 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 600V | LC3 | Polypropylene (PP) | 0.3 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 0.25 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 700V | LC3 | Polypropylene (PP) | 1.2 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 0.33 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 700V | LC3 | Polypropylene (PP) | 1 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 0.66 µF | Nonstandard | Solder Pads | - | - | 1.358" (34.50mm) | 700V | LC3 | Polypropylene (PP) | 0.8 mOhms | 3.071" L x 3.071" W (78.00mm x 78.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 0.33 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 700V | LC3 | Polypropylene (PP) | 1 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 0.66 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 700V | LC3 | Polypropylene (PP) | 0.8 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 1 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 600V | LC3 | Polypropylene (PP) | 0.5 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 1.2 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 600V | LC3 | Polypropylene (PP) | 0.5 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 0.2 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 1000V (1kV) | LC3 | Polypropylene (PP) | 1.2 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 0.25 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 700V | LC3 | Polypropylene (PP) | 1.2 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Chassis Mount | - | - | -40°C ~ 85°C | ±10% | 1.32 µF | Nonstandard | Solder Pads | - | - | 1.339" (34.00mm) | 600V | LC3 | Polypropylene (PP) | 0.3 mOhms | 1.969" L x 1.969" W (50.00mm x 50.00mm) | Conduction Cooled; High Pulse, DV/DT |
告诉我们您在找什么?