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| ![IL-FHJ-33S-HF-N1 IL-FHJ-33S-HF-N1](/static/img/products/zhEmpty.png) | CONN FPC BOTTOM 33POS 0.30MM R/A | | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Solder | Gold | UL94 V-0 | Copper Alloy | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP), Glass Filled | 33 | FPC | 0.012" (0.30mm) | 50V | IL-FHJ | Contacts, Bottom | 0.20mm | 0.079" (2.00mm) | Flip Lock | Tapered | Polyphenylene Sulfide (PPS), Glass Filled | Low Insertion Force (LIF) |
| ![IL-FHJ-17S-HF-N1 IL-FHJ-17S-HF-N1](/static/img/products/zhEmpty.png) | CONN FPC BOTTOM 17POS 0.30MM R/A | | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Solder | Gold | UL94 V-0 | Copper Alloy | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP), Glass Filled | 17 | FPC | 0.012" (0.30mm) | 50V | IL-FHJ | Contacts, Bottom | 0.20mm | 0.079" (2.00mm) | Flip Lock | Tapered | Polyphenylene Sulfide (PPS), Glass Filled | Low Insertion Force (LIF) |
| ![IL-FHJ-21S-HF-N1 IL-FHJ-21S-HF-N1](/static/img/products/zhEmpty.png) | CONN FPC BOTTOM 21POS 0.30MM R/A | | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Solder | Gold | UL94 V-0 | Copper Alloy | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP), Glass Filled | 21 | FPC | 0.012" (0.30mm) | 50V | IL-FHJ | Contacts, Bottom | 0.20mm | 0.079" (2.00mm) | Flip Lock | Tapered | Polyphenylene Sulfide (PPS), Glass Filled | Low Insertion Force (LIF) |
| ![IL-FHJ-27S-HF-N1 IL-FHJ-27S-HF-N1](/static/img/products/zhEmpty.png) | CONN FPC BOTTOM 27POS 0.30MM R/A | | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Solder | Gold | UL94 V-0 | Copper Alloy | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP), Glass Filled | 27 | FPC | 0.012" (0.30mm) | 50V | IL-FHJ | Contacts, Bottom | 0.20mm | 0.079" (2.00mm) | Flip Lock | Tapered | Polyphenylene Sulfide (PPS), Glass Filled | Low Insertion Force (LIF) |
| ![IL-FHJ-45S-HF-N1 IL-FHJ-45S-HF-N1](/static/img/products/zhEmpty.png) | CONN FPC BOTTOM 45POS 0.30MM R/A | | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Solder | Gold | UL94 V-0 | Copper Alloy | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP), Glass Filled | 45 | FPC | 0.012" (0.30mm) | 50V | IL-FHJ | Contacts, Bottom | 0.20mm | 0.079" (2.00mm) | Flip Lock | Tapered | Polyphenylene Sulfide (PPS), Glass Filled | Low Insertion Force (LIF) |
| ![IL-FHJ-39S-HF-N1 IL-FHJ-39S-HF-N1](/static/img/products/zhEmpty.png) | CONN FPC BOTTOM 39POS 0.30MM R/A | | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Solder | Gold | UL94 V-0 | Copper Alloy | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP), Glass Filled | 39 | FPC | 0.012" (0.30mm) | 50V | IL-FHJ | Contacts, Bottom | 0.20mm | 0.079" (2.00mm) | Flip Lock | Tapered | Polyphenylene Sulfide (PPS), Glass Filled | Low Insertion Force (LIF) |
| ![IL-FHJ-57S-HF-N1 IL-FHJ-57S-HF-N1](/static/img/products/zhEmpty.png) | CONN FPC BOTTOM 57POS 0.30MM R/A | | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Solder | Gold | UL94 V-0 | Copper Alloy | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP), Glass Filled | 57 | FPC | 0.012" (0.30mm) | 50V | IL-FHJ | Contacts, Bottom | 0.20mm | 0.079" (2.00mm) | Flip Lock | Tapered | Polyphenylene Sulfide (PPS), Glass Filled | Low Insertion Force (LIF) |
| ![IL-FHJ-51S-HF-N1 IL-FHJ-51S-HF-N1](/static/img/products/zhEmpty.png) | CONN FPC BOTTOM 51POS 0.30MM R/A | | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Solder | Gold | UL94 V-0 | Copper Alloy | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP), Glass Filled | 51 | FPC | 0.012" (0.30mm) | 50V | IL-FHJ | Contacts, Bottom | 0.20mm | 0.079" (2.00mm) | Flip Lock | Tapered | Polyphenylene Sulfide (PPS), Glass Filled | Low Insertion Force (LIF) |