Edge Rate™ HSEC1 Series, 边缘板连接器

结果:
45
Manufacturer
Series
Number of Positions
Number of Positions/Bay/Row
Features
Contact Finish Thickness
Card Type
Operating Temperature
Number of Rows
Color
Read Out
Contact Finish
Termination
Contact Type
Flange Feature
Gender
Mounting Type
Card Thickness
Contact Material
Pitch
结果45
搜索条目:
Edge Rate™ HSEC1
选择
图片产品详情单价可用性ECAD 模型Mounting TypeTerminationNumber of RowsContact FinishColorOperating TemperatureContact MaterialContact Finish ThicknessCard ThicknessFlange FeatureNumber of PositionsFeaturesGenderPitchCard TypeRead OutContact TypeNumber of Positions/Bay/RowSeries
HSEC1-050-01-L-DV-WT-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
100
Pick and Place, Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
23; 27
Edge Rate™ HSEC1
HSEC1-050-01-S-DV-WT-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
30.0µin (0.76µm)
0.062" (1.57mm)
-
100
Pick and Place, Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
23; 27
Edge Rate™ HSEC1
HSEC1-030-01-S-DV-WT-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
30.0µin (0.76µm)
0.062" (1.57mm)
-
60
Pick and Place, Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
30
Edge Rate™ HSEC1
HSEC1-050-01-L-DV-A-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
100
Board Guide
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
23; 27
Edge Rate™ HSEC1
HSEC1-050-01-L-DV-WT-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
100
Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
23; 27
Edge Rate™ HSEC1
HSEC1-020-01-S-DV-WT-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
30.0µin (0.76µm)
0.062" (1.57mm)
-
40
Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
20
Edge Rate™ HSEC1
HSEC1-020-01-L-DV-WT-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
40
Pick and Place, Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
20
Edge Rate™ HSEC1
HSEC1-010-01-S-DV-A-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
30.0µin (0.76µm)
0.062" (1.57mm)
-
20
Board Guide, Pick and Place
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
10
Edge Rate™ HSEC1
HSEC1-010-01-F-DV-A-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
3.00µin (0.076µm)
0.062" (1.57mm)
-
20
Board Guide
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
10
Edge Rate™ HSEC1
HSEC1-060-01-L-DV-WT-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
120
Pick and Place, Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
28; 32
Edge Rate™ HSEC1
HSEC1-010-01-L-DV-A-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
20
Board Guide
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
10
Edge Rate™ HSEC1
HSEC1-050-01-S-DV-A-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
30.0µin (0.76µm)
0.062" (1.57mm)
-
100
Board Guide
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
23; 27
Edge Rate™ HSEC1
HSEC1-010-01-L-DV-WT-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
20
Pick and Place, Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
10
Edge Rate™ HSEC1
HSEC1-020-01-L-DV-A-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
40
Board Guide, Pick and Place
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
20
Edge Rate™ HSEC1
HSEC1-020-01-L-DV-A-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
40
Board Guide
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
20
Edge Rate™ HSEC1
HSEC1-040-01-S-DV-A-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
30.0µin (0.76µm)
0.062" (1.57mm)
-
80
Board Guide
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
18; 22
Edge Rate™ HSEC1
HSEC1-030-01-L-DV-WT-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
60
Pick and Place, Solder Retention
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
30
Edge Rate™ HSEC1
HSEC1-040-01-L-DV-A-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
10.0µin (0.25µm)
0.062" (1.57mm)
-
80
Board Guide, Pick and Place
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
18; 22
Edge Rate™ HSEC1
HSEC1-020-01-S-DV-A-K-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
30.0µin (0.76µm)
0.062" (1.57mm)
-
40
Board Guide, Pick and Place
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
20
Edge Rate™ HSEC1
HSEC1-020-01-S-DV-A-TR
1.00 MM EDGE RATE HIGH-SPEED EDG
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Gold
Black
-55°C ~ 125°C
Phosphor Bronze
30.0µin (0.76µm)
0.062" (1.57mm)
-
40
Board Guide
Female
0.039" (1.00mm)
PCI Express™
Dual
Cantilever
20
Edge Rate™ HSEC1

关于  边缘板连接器

卡缘连接器,也称为边缘板连接器,是一种广泛应用于各种应用的流行连接器系统。 这些连接器利用位于印刷电路板 (PCB) 边缘的裸露铜区域图案来形成配对连接器对的一半。 卡缘连接器的一种常见应用是将附件卡(例如图形加速器)连接到台式电脑应用中的计算机主板。 PCB 上裸露的铜区域用作连接器系统的公触点,而互补的母触点则容纳在配合连接器内。 卡缘连接器的主要优势之一是与其他连接器选项相比,其成本相对较低。 这使得它们成为注重成本效率的应用的有吸引力的选择。 此外,卡缘连接器提供高密度互连功能,允许在紧凑的空间内连接大量信号或电源线。 值得注意的是,对于主要关注耐用性的应用,卡缘连接器可能不是首选。 虽然它们提供可靠的电气连接,但它们可能无法提供与更坚固的连接器系统相同水平的机械强度和保护。 总之,卡缘连接器是一种经济高效的高密度互连选项,通常用于将附件卡连接到台式电脑应用中的主板。 他们的设计在 PCB 上采用了裸露的铜区域,形成了配对连接器对的一半。 虽然它们可能不适合需要卓越耐用性的应用,但它们为许多连接需求提供了实用的解决方案。