RM Series, 陶瓷电容器

结果:
8
Manufacturer
Series
Capacitance
Thickness (Max)
Package / Case
Voltage - Rated
Size / Dimension
Lead Style
Operating Temperature
Applications
Height - Seated (Max)
Tolerance
Lead Spacing
Temperature Coefficient
Mounting Type
Ratings
Features
Failure Rate
结果8
搜索条目:
RM
选择
图片产品详情单价可用性ECAD 模型Height - Seated (Max)ToleranceSeriesOperating TemperatureRatingsVoltage - RatedTemperature CoefficientMounting TypeApplicationsFailure RateCapacitanceFeaturesPackage / CaseSize / DimensionThickness (Max)Lead SpacingLead Style
RM045C306KAJ480
CAP CER 30UF 50V X7R SMD
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数量
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PCB Symbol, Footprint & 3D Model
-
±10%
RM
-55°C ~ 125°C
-
50V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
30 µF
Low ESL (Stacked)
Stacked SMD, 8 J-Lead
0.402" L x 0.441" W (10.20mm x 11.20mm)
0.560" (14.22mm)
-
J-Lead
RM045C156KAJ240
CAP CER 15UF 50V X7R SMD
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数量
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PCB Symbol, Footprint & 3D Model
-
±10%
RM
-55°C ~ 125°C
-
50V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
15 µF
Low ESL (Stacked)
Stacked SMD, 8 J-Lead
0.402" L x 0.441" W (10.20mm x 11.20mm)
0.320" (8.13mm)
-
J-Lead
RM055C105KAJ120
CAP CER 1UF 50V X7R SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
RM
-55°C ~ 125°C
-
50V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
1 µF
Low ESL (Stacked)
Stacked SMD, 6 J-Lead
0.250" L x 0.300" W (6.35mm x 7.62mm)
0.200" (5.08mm)
-
J-Lead
RM055C155KAJ120
CAP CER 1.5UF 50V X7R SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
RM
-55°C ~ 125°C
-
50V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
1.5 µF
Low ESL (Stacked)
Stacked SMD, 6 J-Lead
0.250" L x 0.300" W (6.35mm x 7.62mm)
0.200" (5.08mm)
-
J-Lead
RM045C755KAJ120
CAP CER 7.5UF 50V X7R SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
RM
-55°C ~ 125°C
-
50V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
7.5 µF
Low ESL (Stacked)
Stacked SMD, 8 J-Lead
0.402" L x 0.441" W (10.20mm x 11.20mm)
0.200" (5.08mm)
-
J-Lead
RM055C475KAJ240
CAP CER 4.7UF 50V X7R SMD
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数量
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PCB Symbol, Footprint & 3D Model
-
±10%
RM
-55°C ~ 125°C
-
50V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
4.7 µF
Low ESL (Stacked)
Stacked SMD, 6 J-Lead
0.250" L x 0.300" W (6.35mm x 7.62mm)
0.320" (8.13mm)
-
J-Lead
RM055C825KAL360
CAP CER 8.2UF 50V X7R SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
RM
-55°C ~ 125°C
-
50V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
8.2 µF
Low ESL (Stacked)
Stacked SMD, 6 L-Lead
0.250" L x 0.300" W (6.35mm x 7.62mm)
0.360" (9.14mm)
-
L-Lead
RM042C225KAJ240
CAP CER 2.2UF 200V X7R SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
RM
-55°C ~ 125°C
-
200V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
2.2 µF
Low ESL (Stacked)
Stacked SMD, 8 J-Lead
0.402" L x 0.441" W (10.20mm x 11.20mm)
0.320" (8.13mm)
-
J-Lead

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。