TurboCap™ Series, 陶瓷电容器
结果:
19
Manufacturer
Series
Package / Case
Capacitance
Size / Dimension
Voltage - Rated
Thickness (Max)
Lead Style
Height - Seated (Max)
Lead Spacing
Mounting Type
Operating Temperature
Applications
Tolerance
Temperature Coefficient
Ratings
Features
Failure Rate
结果：19
搜索条目:
TurboCap™
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Height - Seated (Max) | Tolerance | Operating Temperature | Ratings | Voltage - Rated | Temperature Coefficient | Capacitance | Mounting Type | Applications | Failure Rate | Series | Features | Package / Case | Size / Dimension | Thickness (Max) | Lead Spacing | Lead Style |
|---|
 | 1+ ¥360.0000 5+ ¥340.0000 10+ ¥320.0000 更多的价格 | 32 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 50V | X7R | 100 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 20 L-Lead | 1.025" L x 0.300" W (26.04mm x 7.62mm) | 0.220" (5.59mm) | - | L-Lead | ||
.jpg "ST121C226MAJ10") | 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 100V | X7R | 22 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 20 J-Lead | 1.050" L x 0.250" W (26.67mm x 6.35mm) | 0.140" (3.56mm) | - | J-Lead | ||
 | 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 100V | X7R | 47 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 20 J-Lead | 1.025" L x 0.300" W (26.04mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 100V | X7R | 14 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 6 J-Lead | 0.325" L x 0.300" W (8.26mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 50V | X7R | 100 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 20 J-Lead | 1.025" L x 0.300" W (26.04mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 25V | X7R | 100 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 10 J-Lead | 0.525" L x 0.300" W (13.34mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.220" (5.59mm) | ±20% | -55°C ~ 125°C | - | 50V | X7R | 47 µF | Through Hole | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked DIP, 10 Lead | 0.525" L x 0.300" W (13.34mm x 7.62mm) | - | 0.220" (5.59mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 25V | X7R | 68 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 6 J-Lead | 0.325" L x 0.300" W (8.26mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.220" (5.59mm) | ±20% | -55°C ~ 125°C | - | 50V | X7R | 100 µF | Through Hole | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked DIP, 20 Lead | 1.025" L x 0.300" W (26.04mm x 7.62mm) | - | 0.220" (5.59mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 100V | X7R | 22 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 10 J-Lead | 0.525" L x 0.300" W (13.34mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 50V | X7R | 47 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 10 J-Lead | 0.525" L x 0.300" W (13.34mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 50V | X7R | 27 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 6 J-Lead | 0.325" L x 0.300" W (8.26mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.220" (5.59mm) | ±20% | -55°C ~ 125°C | - | 50V | X7R | 27 µF | Through Hole | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked DIP, 6 Lead | 0.325" L x 0.300" W (8.26mm x 7.62mm) | - | 0.220" (5.59mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 25V | X7R | 220 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 20 J-Lead | 1.025" L x 0.300" W (26.04mm x 7.62mm) | 0.220" (5.59mm) | - | J-Lead | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 50V | X7R | 47 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 10 L-Lead | 0.525" L x 0.300" W (13.34mm x 7.62mm) | 0.220" (5.59mm) | - | L-Lead | ||
.jpg "ST121C126MAJ05") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 100V | X7R | 12 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 10 J-Lead | 0.575" L x 0.250" W (14.61mm x 6.35mm) | 0.140" (3.56mm) | - | J-Lead | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 50V | X7R | 27 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 10 J-Lead | 0.575" L x 0.250" W (14.61mm x 6.35mm) | 0.140" (3.56mm) | - | J-Lead | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 50V | X7R | 27 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 6 L-Lead | 0.325" L x 0.300" W (8.26mm x 7.62mm) | 0.220" (5.59mm) | - | L-Lead | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 50V | X7R | 50 µF | Surface Mount, MLCC | SMPS Filtering, Bypass, Decoupling | - | TurboCap™ | Low ESL (Stacked) | Stacked SMD, 20 J-Lead | 1.050" L x 0.250" W (26.67mm x 6.35mm) | 0.140" (3.56mm) | - | J-Lead |
关于 陶瓷电容器
电容器是必不可少的被动电子元件，具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。
陶瓷电容器在各种应用中得到广泛使用，包括汽车电子、旁路、解耦、滤波、射频（RF）电路和静电放电（ESD）保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。
陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状，并配有两根导线引脚，便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。
陶瓷电容器具有许多优点，包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册，指定电容值、电压等级、公差和其他重要参数，以帮助正确选择和应用。
总之，陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成，插入式版本具有圆盘形或块状形状，并配有两根导线引脚，便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性，因此在电子设计中备受青睐。
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