SMD Comm X8L HT150C Series, 陶瓷电容器
结果:
53
Manufacturer
Series
Capacitance
Thickness (Max)
Size / Dimension
Package / Case
Applications
Voltage - Rated
Tolerance
Features
Operating Temperature
Height - Seated (Max)
Lead Spacing
Temperature Coefficient
Mounting Type
Ratings
Failure Rate
Lead Style
结果：53
搜索条目:
SMD Comm X8L HT150C
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Height - Seated (Max) | Tolerance | Applications | Operating Temperature | Ratings | Package / Case | Voltage - Rated | Capacitance | Features | Mounting Type | Lead Style | Failure Rate | Series | Temperature Coefficient | Thickness (Max) | Lead Spacing | Size / Dimension |
|---|
-2,00x1,20x1,00mm_tmb.jpg "C0805C224K5NAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 0805 (2012 Metric) | 50V | 0.22 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.055" (1.40mm) | - | 0.079" L x 0.049" W (2.00mm x 1.25mm) | ||
-3,20x2,50x2,80mm_tmb.jpg "C1210C106K8NAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1210 (3225 Metric) | 10V | 10 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.110" (2.80mm) | - | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | General Purpose | -55°C ~ 150°C | - | 1210 (3225 Metric) | 10V | 10 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.110" (2.80mm) | - | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ||
-3,20x1,60x1,10mm_tmb.jpg "C1206C105K3NAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1206 (3216 Metric) | 25V | 1 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.043" (1.10mm) | - | 0.126" L x 0.063" W (3.20mm x 1.60mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | Boardflex Sensitive | -55°C ~ 150°C | - | 0805 (2012 Metric) | 25V | 0.22 µF | Soft Termination, High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.039" (1.00mm) | - | 0.079" L x 0.049" W (2.00mm x 1.25mm) | ||
-3,20x1,60x1,80mm_tmb.jpg "C1206C225K3NAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1206 (3216 Metric) | 25V | 2.2 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.071" (1.80mm) | - | 0.126" L x 0.063" W (3.20mm x 1.60mm) | ||
_tmb.jpg "C1210X106K8NAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | Boardflex Sensitive | -55°C ~ 150°C | - | 1210 (3225 Metric) | 10V | 10 µF | Soft Termination, High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.110" (2.80mm) | - | 0.130" L x 0.102" W (3.30mm x 2.60mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | Boardflex Sensitive | -55°C ~ 150°C | - | 1206 (3216 Metric) | 10V | 1.5 µF | Soft Termination, High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.071" (1.80mm) | - | 0.130" L x 0.063" W (3.30mm x 1.60mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1206 (3216 Metric) | 10V | 3.3 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.071" (1.80mm) | - | 0.126" L x 0.063" W (3.20mm x 1.60mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1210 (3225 Metric) | 25V | 4.7 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.110" (2.80mm) | - | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 0805 (2012 Metric) | 25V | 0.68 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.057" (1.45mm) | - | 0.079" L x 0.049" W (2.00mm x 1.25mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | General Purpose | -55°C ~ 150°C | - | 0805 (2012 Metric) | 10V | 1 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.039" (1.00mm) | - | 0.079" L x 0.049" W (2.00mm x 1.25mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | General Purpose | -55°C ~ 150°C | - | 0805 (2012 Metric) | 25V | 0.68 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.057" (1.45mm) | - | 0.079" L x 0.049" W (2.00mm x 1.25mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1210 (3225 Metric) | 25V | 3.3 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.075" (1.90mm) | - | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ||
-3,20x1,60x1,35mm_tmb.jpg "C1206C474J5NAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | General Purpose | -55°C ~ 150°C | - | 1206 (3216 Metric) | 50V | 0.47 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.069" (1.75mm) | - | 0.126" L x 0.063" W (3.20mm x 1.60mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1206 (3216 Metric) | 10V | 4.7 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.071" (1.80mm) | - | 0.126" L x 0.063" W (3.20mm x 1.60mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1210 (3225 Metric) | 25V | 2.2 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.055" (1.40mm) | - | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 1206 (3216 Metric) | 25V | 1.5 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.071" (1.80mm) | - | 0.126" L x 0.063" W (3.20mm x 1.60mm) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | General Purpose | -55°C ~ 150°C | - | 0805 (2012 Metric) | 25V | 0.47 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.043" (1.10mm) | - | 0.079" L x 0.049" W (2.00mm x 1.25mm) | ||
-Ceramic-Capacitor_tmb.jpg "C0402C473J8NAC7867") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | General Purpose | -55°C ~ 150°C | - | 0402 (1005 Metric) | 10V | 0.047 µF | High Temperature | Surface Mount, MLCC | - | - | SMD Comm X8L HT150C | X8L | 0.022" (0.55mm) | - | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
关于 陶瓷电容器
电容器是必不可少的被动电子元件，具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。
陶瓷电容器在各种应用中得到广泛使用，包括汽车电子、旁路、解耦、滤波、射频（RF）电路和静电放电（ESD）保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。
陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状，并配有两根导线引脚，便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。
陶瓷电容器具有许多优点，包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册，指定电容值、电压等级、公差和其他重要参数，以帮助正确选择和应用。
总之，陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成，插入式版本具有圆盘形或块状形状，并配有两根导线引脚，便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性，因此在电子设计中备受青睐。
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