选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Height - Seated (Max) | Tolerance | Operating Temperature | Ratings | Package / Case | Voltage - Rated | Mounting Type | Applications | Lead Style | Failure Rate | Series | Capacitance | Temperature Coefficient | Features | Thickness (Max) | Lead Spacing | Size / Dimension |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 16V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 7500 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 0805 (2012 Metric) | 16V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 6200 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±20% | -55°C ~ 125°C | - | 0805 (2012 Metric) | 10V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 5100 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 1206 (3216 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 0.068 µF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.035" (0.88mm) | - | 0.130" L x 0.063" W (3.30mm x 1.60mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±2% | -55°C ~ 125°C | - | 1206 (3216 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 0.022 µF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.035" (0.88mm) | - | 0.130" L x 0.063" W (3.30mm x 1.60mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 1206 (3216 Metric) | 16V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 0.068 µF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.035" (0.88mm) | - | 0.130" L x 0.063" W (3.30mm x 1.60mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±2% | -55°C ~ 125°C | - | 1206 (3216 Metric) | 16V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 0.022 µF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.035" (0.88mm) | - | 0.130" L x 0.063" W (3.30mm x 1.60mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 1206 (3216 Metric) | 10V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 0.068 µF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.035" (0.88mm) | - | 0.130" L x 0.063" W (3.30mm x 1.60mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 16V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 9100 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 9100 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 1100 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 7500 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 16V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 6200 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 6200 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 16V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 5100 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 5100 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 16V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 4300 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 4300 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 3600 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 0603 (1608 Metric) | 25V | Surface Mount, MLCC | Boardflex Sensitive | - | - | SMD Comm U2J Flex | 3000 pF | U2J | Low ESL, Soft Termination, Low Dissipation Factor | 0.034" (0.87mm) | - | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
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