SMD Comm C0G HV Flex Series, 陶瓷电容器

结果:
56
Manufacturer
Series
Capacitance
Thickness (Max)
Size / Dimension
Package / Case
Voltage - Rated
Tolerance
Operating Temperature
Applications
Height - Seated (Max)
Lead Spacing
Mounting Type
Temperature Coefficient
Ratings
Features
Failure Rate
Lead Style
结果56
搜索条目:
SMD Comm C0G HV Flex
选择
图片产品详情单价可用性ECAD 模型Height - Seated (Max)ToleranceOperating TemperatureRatingsVoltage - RatedCapacitanceTemperature CoefficientPackage / CaseMounting TypeApplicationsLead StyleFailure RateSeriesFeaturesThickness (Max)Lead SpacingSize / Dimension
C2220X331JFGAC7800
CAP CER 330PF 1.5KV C0G/NP0 2220
1+
¥34.1923
5+
¥32.2927
10+
¥30.3931
数量
2,321 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1500V (1.5kV)
330 pF
C0G, NP0
2220 (5750 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.061" (1.55mm)
-
0.224" L x 0.197" W (5.70mm x 5.00mm)
C1808X332JBGAC7800
CAP CER 3300PF 630V C0G/NP0 1808
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
630V
3300 pF
C0G, NP0
1808 (4520 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.059" (1.50mm)
-
0.185" L x 0.079" W (4.70mm x 2.00mm)
C2220X103JDGAC7800
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1000V (1kV)
10000 pF
C0G, NP0
2220 (5750 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.087" (2.20mm)
-
0.232" L x 0.197" W (5.90mm x 5.00mm)
C1206X471JBGAC
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
630V
470 pF
C0G, NP0
1206 (3216 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.047" (1.20mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C1206X471JCGAC7800
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
500V
470 pF
C0G, NP0
1206 (3216 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.047" (1.20mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C1206X470KGGAC7800
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
2000V (2kV)
47 pF
C0G, NP0
1206 (3216 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.047" (1.20mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C0805X101JCGAC7800
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
500V
100 pF
C0G, NP0
0805 (2012 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.055" (1.40mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
C1825X152JGGAC7800
CAP CER 1500PF 2KV C0G/NP0 1825
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
2000V (2kV)
1500 pF
C0G, NP0
1825 (4564 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.061" (1.55mm)
-
0.177" L x 0.252" W (4.50mm x 6.40mm)
C1210X223KBGAC7800
CAP CER 0.022UF 630V C0G 1210
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
630V
0.022 µF
C0G, NP0
1210 (3225 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.087" (2.20mm)
-
0.130" L x 0.102" W (3.30mm x 2.60mm)
C1210X223JDGACTU
CAP .022UF 1KV COG 1210 FLEX
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1000V (1kV)
0.022 µF
C0G, NP0
1210 (3225 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.110" (2.80mm)
-
0.130" L x 0.102" W (3.30mm x 2.60mm)
C1206X332JBGAC7800
CAP CER 3300PF 630V C0G/NP0 1206
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
630V
3300 pF
C0G, NP0
1206 (3216 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.035" (0.88mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C1210X822JCGAC7800
CAP CER 8200PF 500V C0G/NP0 1210
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
500V
8200 pF
C0G, NP0
1210 (3225 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.035" (0.88mm)
-
0.130" L x 0.102" W (3.30mm x 2.60mm)
C1206X202FBGAC7800
CAP CER 2000PF 630V C0G/NP0 1206
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±1%
-55°C ~ 125°C
-
630V
2000 pF
C0G, NP0
1206 (3216 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.039" (0.98mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C0805X221JDGAC7800
CAP CER 220PF 1KV C0G/NP0 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1000V (1kV)
220 pF
C0G, NP0
0805 (2012 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
-
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
C1206X330JDGAC7800
CAP CER 33PF 1KV C0G/NP0 1206
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1000V (1kV)
33 pF
C0G, NP0
1206 (3216 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.069" (1.75mm)
-
0.126" L x 0.063" W (3.20mm x 1.60mm)
C1210X222JDGAC7800
CAP CER 2200PF 1KV C0G/NP0 1210
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1000V (1kV)
2200 pF
C0G, NP0
1210 (3225 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.110" (2.80mm)
-
0.130" L x 0.102" W (3.30mm x 2.60mm)
C1210X223MBGAC7800
CAP CER 0.022UF 630V C0G 1210
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
630V
0.022 µF
C0G, NP0
1210 (3225 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.087" (2.20mm)
-
0.130" L x 0.102" W (3.30mm x 2.60mm)
C1206X472JBGAC7800
CAP CER 4700PF 630V C0G/NP0 1206
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
630V
4700 pF
C0G, NP0
1206 (3216 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.047" (1.20mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C1206X103JBGACTU
1206 .01UF 5% 630VDC COG FLEX
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
630V
10000 pF
C0G, NP0
1206 (3216 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
0.073" (1.85mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C0805X821JCGAC7800
CAP CER 820PF 500V C0G/NP0 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
500V
820 pF
C0G, NP0
0805 (2012 Metric)
Surface Mount, MLCC
Boardflex Sensitive
-
-
SMD Comm C0G HV Flex
Low ESL, Soft Termination, High Voltage
-
-
0.079" L x 0.049" W (2.00mm x 1.25mm)

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。