SMD Comm C0G Flex Series, 陶瓷电容器
结果:
229
Manufacturer
Series
Capacitance
Thickness (Max)
Tolerance
Size / Dimension
Voltage - Rated
Package / Case
Operating Temperature
Applications
Height - Seated (Max)
Lead Spacing
Mounting Type
Temperature Coefficient
Ratings
Features
Failure Rate
Lead Style
结果：229
搜索条目:
SMD Comm C0G Flex
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Height - Seated (Max) | Tolerance | Operating Temperature | Ratings | Voltage - Rated | Capacitance | Temperature Coefficient | Package / Case | Mounting Type | Applications | Features | Lead Style | Failure Rate | Series | Size / Dimension | Thickness (Max) | Lead Spacing |
|---|
 | 联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 50V | 0.47 µF | C0G, NP0 | 2220 (5750 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.232" L x 0.197" W (5.90mm x 5.00mm) | 0.073" (1.85mm) | - | ||
-Ceramic-Capacitor_tmb.jpg "C0603X472F5GAC7867") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±1% | -55°C ~ 125°C | - | 50V | 4700 pF | C0G, NP0 | 0603 (1608 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.063" L x 0.031" W (1.60mm x 0.80mm) | 0.037" (0.95mm) | - | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±1% | -55°C ~ 125°C | - | 25V | 4700 pF | C0G, NP0 | 0805 (2012 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.079" L x 0.049" W (2.00mm x 1.25mm) | 0.047" (1.20mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±1% | -55°C ~ 125°C | - | 100V | 470 pF | C0G, NP0 | 0805 (2012 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.079" L x 0.049" W (2.00mm x 1.25mm) | 0.039" (0.98mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 250V | 0.022 µF | C0G, NP0 | 1206 (3216 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.130" L x 0.063" W (3.30mm x 1.60mm) | 0.071" (1.80mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 25V | 0.047 µF | C0G, NP0 | 0805 (2012 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.079" L x 0.049" W (2.00mm x 1.25mm) | 0.055" (1.40mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 200V | 220 pF | C0G, NP0 | 1206 (3216 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.130" L x 0.063" W (3.30mm x 1.60mm) | 0.039" (0.98mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±1% | -55°C ~ 125°C | - | 200V | 100 pF | C0G, NP0 | 0603 (1608 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.063" L x 0.031" W (1.60mm x 0.80mm) | 0.037" (0.95mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 50V | 120 pF | C0G, NP0 | 0603 (1608 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.063" L x 0.031" W (1.60mm x 0.80mm) | 0.034" (0.87mm) | - | ||
-3,20x1,60x1,35mm_tmb.jpg "C1206X472J5GAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 50V | 4700 pF | C0G, NP0 | 1206 (3216 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.130" L x 0.063" W (3.30mm x 1.60mm) | 0.043" (1.10mm) | - | ||
-3,20x1,60x1,00mm_tmb.jpg "C1206X103JAGAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 250V | 10000 pF | C0G, NP0 | 1206 (3216 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.130" L x 0.063" W (3.30mm x 1.60mm) | 0.039" (1.00mm) | - | ||
-0,33mm-C-Series_tmb.jpg "C0603X330J5GAC3121") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 50V | 33 pF | C0G, NP0 | 0603 (1608 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.063" L x 0.031" W (1.60mm x 0.80mm) | 0.037" (0.95mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 50V | 100 pF | C0G, NP0 | 0603 (1608 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.063" L x 0.031" W (1.60mm x 0.80mm) | 0.037" (0.95mm) | - | ||
-2,00x1,20x1,00mm_tmb.jpg "C0805X100J1GAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 100V | 10 pF | C0G, NP0 | 0805 (2012 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.079" L x 0.049" W (2.00mm x 1.25mm) | 0.039" (0.98mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 25V | 0.1 µF | C0G, NP0 | 1206 (3216 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.130" L x 0.063" W (3.30mm x 1.60mm) | 0.071" (1.80mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±10% | -55°C ~ 125°C | - | 50V | 47 pF | C0G, NP0 | 0603 (1608 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.063" L x 0.031" W (1.60mm x 0.80mm) | 0.037" (0.95mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 50V | 47 pF | C0G, NP0 | 0805 (2012 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.079" L x 0.049" W (2.00mm x 1.25mm) | 0.035" (0.88mm) | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 50V | 2200 pF | C0G, NP0 | 0603 (1608 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.063" L x 0.031" W (1.60mm x 0.80mm) | 0.037" (0.95mm) | - | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 50V | 1000 pF | C0G, NP0 | 1210 (3225 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.130" L x 0.102" W (3.30mm x 2.60mm) | 0.035" (0.88mm) | - | ||
_tmb.jpg "C1210X103J1GAC7800") | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ±5% | -55°C ~ 125°C | - | 100V | 10000 pF | C0G, NP0 | 1210 (3225 Metric) | Surface Mount, MLCC | Boardflex Sensitive | Low ESL, Soft Termination | - | - | SMD Comm C0G Flex | 0.130" L x 0.102" W (3.30mm x 2.60mm) | 0.049" (1.25mm) | - |
关于 陶瓷电容器
电容器是必不可少的被动电子元件，具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。
陶瓷电容器在各种应用中得到广泛使用，包括汽车电子、旁路、解耦、滤波、射频（RF）电路和静电放电（ESD）保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。
陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状，并配有两根导线引脚，便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。
陶瓷电容器具有许多优点，包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册，指定电容值、电压等级、公差和其他重要参数，以帮助正确选择和应用。
总之，陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成，插入式版本具有圆盘形或块状形状，并配有两根导线引脚，便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性，因此在电子设计中备受青睐。
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