KPS-MCC Indust C0G HT200C Series, 陶瓷电容器

结果:
10
Manufacturer
Series
Capacitance
Voltage - Rated
Height - Seated (Max)
Lead Spacing
Size / Dimension
Package / Case
Operating Temperature
Applications
Tolerance
Mounting Type
Temperature Coefficient
Ratings
Thickness (Max)
Features
Failure Rate
Lead Style
结果10
搜索条目:
KPS-MCC Indust C0G HT200C
选择
图片产品详情单价可用性ECAD 模型Mounting TypeOperating TemperatureToleranceRatingsVoltage - RatedTemperature CoefficientSize / DimensionApplicationsFailure RateSeriesCapacitanceFeaturesPackage / CaseHeight - Seated (Max)Thickness (Max)Lead SpacingLead Style
L1GN40D274KA05
CAP CER 0.27UF 1KV C0G/NP0 8LEAD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
1000V (1kV)
C0G, NP0
0.400" L x 0.440" W (10.16mm x 11.18mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.27 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 8 Lead
0.600" (15.24mm)
-
0.400" (10.16mm)
Straight
L1GN50G253KA05
CAP CER 0.025UF 2KV C0G 6 LEAD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
2000V (2kV)
C0G, NP0
0.250" L x 0.300" W (6.35mm x 7.62mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.025 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 6 Lead
0.600" (15.24mm)
-
0.250" (6.35mm)
Straight
L1GN50B563KA02
CAP CER 0.056UF 630V C0G 6 LEAD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
630V
C0G, NP0
0.250" L x 0.300" W (6.35mm x 7.62mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.056 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 6 Lead
0.280" (7.11mm)
-
0.250" (6.35mm)
Straight
L1GN501604KA02
CAP CER 0.6UF 100V C0G/NP0 6LEAD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
100V
C0G, NP0
0.250" L x 0.300" W (6.35mm x 7.62mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.6 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 6 Lead
0.280" (7.11mm)
-
0.250" (6.35mm)
Straight
L1GN40C474KA04
CAP CER 0.47UF 500V C0G 8 LEAD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
500V
C0G, NP0
0.400" L x 0.440" W (10.16mm x 11.18mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.47 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 8 Lead
0.490" (12.45mm)
-
0.400" (10.16mm)
Straight
L1GN501155KA05
CAP CER 1.5UF 100V C0G/NP0 6LEAD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
100V
C0G, NP0
0.250" L x 0.300" W (6.35mm x 7.62mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
1.5 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 6 Lead
0.600" (15.24mm)
-
0.250" (6.35mm)
Straight
L1GN402105KA03
CAP CER 1UF 200V C0G/NP0 8 LEAD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
200V
C0G, NP0
0.400" L x 0.440" W (10.16mm x 11.18mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
1 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 8 Lead
0.390" (9.91mm)
-
0.400" (10.16mm)
Straight
L1GN30G204KA10
CAP CER 0.2UF 2KV C0G/NP0 20LEAD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
2000V (2kV)
C0G, NP0
1.009" L x 0.500" W (25.64mm x 12.70mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.2 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 20 Lead
0.600" (15.24mm)
-
0.450" (11.43mm)
Straight
L1GN30D334KA04
CAP CER 0.33UF 1KV C0G 20 LEAD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
1000V (1kV)
C0G, NP0
1.009" L x 0.500" W (25.64mm x 12.70mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.33 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 20 Lead
0.280" (7.11mm)
-
0.450" (11.43mm)
Straight
L1GN30C205KA10
CAP CER 2UF 500V C0G/NP0 20 LEAD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
500V
C0G, NP0
1.009" L x 0.500" W (25.64mm x 12.70mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
2 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 20 Lead
0.600" (15.24mm)
-
0.450" (11.43mm)
Straight

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。